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CP325V-MJE181 PDF预览

CP325V-MJE181

更新时间: 2024-09-14 14:50:47
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
4页 855K
描述
60V,3A,1.5W Bare die,40.160 X 40.160 mils,Transistor-Bipolar Power (>1A)

CP325V-MJE181 数据手册

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PROCESS CP325V  
Small Signal Transistor  
NPN - Switching Transistor Chip  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
40 x 40 MILS  
7.1 MILS  
Die Size  
Die Thickness  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
7.9 x 8.7 MILS  
9.0 x 14 MILS  
Al - 30,000Å  
Au - 18,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
6,936  
GROSS DIE PER 5 INCH WAFER  
10,454  
PRINCIPAL DEVICE TYPE  
2N5320  
R0  
R2 (19-September 2011)  
www.centralsemi.com  

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