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BCP69T1G PDF预览

BCP69T1G

更新时间: 2024-11-11 12:49:59
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
4页 101K
描述
PNP Silicon Epitaxial Transistor

BCP69T1G 数据手册

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BCP69T1  
PNP Silicon  
Epitaxial Transistor  
This PNP Silicon Epitaxial Transistor is designed for use in low  
voltage, high current applications. The device is housed in the  
SOT223 package, which is designed for medium power surface  
mount applications.  
http://onsemi.com  
Features  
MEDIUM POWER  
PNP SILICON  
HIGH CURRENT  
TRANSISTOR  
High Current: I = 1.0 A  
The SOT223 Package can be soldered using wave or reflow.  
SOT223 package ensures level mounting, resulting in improved  
thermal conduction, and allows visual inspection of soldered joints.  
The formed leads absorb thermal stress during soldering, eliminating  
the possibility of damage to the die.  
C
SURFACE MOUNT  
NPN Complement is BCP68  
PbFree Package is Available  
COLLECTOR 2,4  
BASE  
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Collector Current  
Symbol Value  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
EMITTER 3  
V
V
V
20  
25  
5.0  
1.0  
CEO  
CBO  
EBO  
MARKING  
DIAGRAM  
4
I
C
1
2
Total Power Dissipation @ T = 25°C (Note 1)  
Derate above 25°C  
P
D
1.5  
12  
W
mW/°C  
A
AYW  
CEG  
3
SOT223 (TO261)  
CASE 318E  
G
Operating and Storage Temperature Range  
T , T  
65 to  
150  
°C  
J
stg  
STYLE 1  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
CE = Specific Device Code  
A
Y
W
G
= Assembly Location  
= Year  
= Work Week  
Thermal Resistance JunctiontoAmbient  
R
83.3  
°C/W  
q
JA  
(Surface Mounted)  
Lead Temperature for Soldering,  
0.0625 in from case  
Time in Solder Bath  
T
260  
10  
°C  
= PbFree Package  
L
(Note: Microdot may be in either location)  
Sec  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.  
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
BCP69T1  
SOT223  
1000 / Tape & Reel  
1000 / Tape & Reel  
BCP69T1G  
SOT223  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
October, 2008 Rev. 8  
BCP69T1/D  
 

BCP69T1G 替代型号

型号 品牌 替代类型 描述 数据表
BCP69T/R NXP

类似代替

TRANSISTOR 1 A, 20 V, PNP, Si, POWER TRANSISTOR, PLASTIC, SMD, SC-73, 4 PIN, BIP General P
BCP69-25T/R NXP

类似代替

TRANSISTOR 1 A, 20 V, PNP, Si, POWER TRANSISTOR, PLASTIC, SMD, SC-73, 4 PIN, BIP General P

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