BC856AW - BC858CW
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
A
•
•
•
•
•
Ideally Suited for Automated Insertion
SOT-323
Complementary NPN Types Available (BC846W-BC848W)
For Switching and AF Amplifier Applications
Lead Free/RoHS Compliant (Note 3)
C
Dim
A
B
C
D
E
Min
0.25
1.15
2.00
Max
0.40
1.35
2.20
C
B
"Green" Device (Note 4 and 5)
B
E
0.65 Nominal
G
H
Mechanical Data
0.30
1.20
1.80
0.0
0.40
1.40
2.20
0.10
1.00
0.40
0.18
8°
G
H
J
•
•
Case: SOT-323
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Pin Connections: See Diagram
Marking Code: See Table Below & Diagram on Page 3
Ordering & Date Code Information: See Page 3
Weight: 0.006 grams (approximate)
K
J
M
•
•
•
K
L
0.90
0.25
0.10
0°
L
D
F
M
α
•
•
•
•
All Dimensions in mm
Marking Code (Note 2)
Type
Marking
K3A
K3B
K3V, K3A
K3W, K3B
Type
Marking
K3G
K3J, K3A, K3V
K3K, K3B, K3W
K3L, K3G
BC856AW
BC856BW
BC857AW
BC857BW
BC857CW
BC858AW
BC858BW
BC858CW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Symbol
Value
-80
-50
-30
-65
Unit
BC856
BC857
BC858
BC856
BC857
BC858
V
VCBO
Collector-Emitter Voltage
-45
-30
V
VCEO
Emitter-Base Voltage
Collector Current
Peak Collector Current
Peak Emitter Current
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
-5.0
V
mA
mA
mA
mW
°C/W
°C
VEBO
IC
ICM
IEM
Pd
-100
-200
-200
200
625
Rθ
JA
-65 to +150
Tj, TSTG
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Current gain subgroup “C” is not available for BC856W.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BC856AW - BC858CW
DS30251 Rev. 8 - 2
1 of 3
© Diodes Incorporated
www.diodes.com