ON Semiconductort
Monolithic Dual Switching Diode
Common Anode
BAW56LT1
ON Semiconductor Preferred Device
MAXIMUM RATINGS (EACH DIODE)
Rating
Symbol
Value
70
Unit
Vdc
3
Reverse Voltage
Forward Current
V
R
1
I
200
500
mAdc
mAdc
F
2
Peak Forward Surge Current
THERMAL CHARACTERISTICS
Characteristic
I
FM(surge)
CASE 318–08, STYLE 12
SOT–23 (TO–236AB)
Symbol
Max
Unit
(1)
Total Device Dissipation FR–5 Board
P
D
225
mW
T = 25°C
A
Derate above 25°C
1.8
556
300
mW/°C
°C/W
mW
Thermal Resistance, Junction to Ambient
R
q
JA
CATHODE
Total Device Dissipation
P
1
D
ANODE
(2)
Alumina Substrate, T = 25°C
A
3
Derate above 25°C
2.4
417
mW/°C
°C/W
°C
2
CATHODE
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
DEVICE MARKING
R
q
JA
T , T
–55 to +150
J
stg
BAW56LT1 = A1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (EACH DIODE)
A
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
V
(BR)
70
—
Vdc
(I
(BR)
= 100 µAdc)
Reverse Voltage Leakage Current
(V = 25 Vdc, T = 150°C)
I
R
µAdc
—
—
—
30
2.5
50
R
J
(V = 70 Vdc)
R
(V = 70 Vdc, T = 150°C)
R
J
Diode Capacitance
(V = 0, f = 1.0 MHz)
R
C
V
—
2.0
pF
D
Forward Voltage
mVdc
F
(I = 1.0 mAdc)
—
—
—
—
715
855
1000
1250
F
(I = 10 mAdc)
F
(I = 50 mAdc)
F
(I = 150 mAdc)
F
Reverse Recovery Time
t
rr
—
6.0
ns
(I = I = 10 mAdc, I
= 1.0 mAdc) (Figure 1) R = 100 Ω
L
F
R
R(REC)
1. FR–5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.
2. Alumina = 0.4 ꢀ 0.3 ꢀ 0.024 in. 99.5% alumina.
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
March, 2001 – Rev. 1
BAW56LT1/D