BAW56LT1G
Dual Switching Diode
Common Anode
Features
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
http://onsemi.com
Compliant
MAXIMUM RATINGS (EACH DIODE)
CATHODE
1
Rating
Reverse Voltage
Symbol
Value
70
Unit
V
ANODE
3
V
R
2
Forward Current
I
200
500
mA
mA
F
CATHODE
Peak Forward Surge Current
I
FM(surge)
Non−Repetitive Peak Forward Current
t = 1 ms (Note 3)
I
FSM
3
4
A
1
THERMAL CHARACTERISTICS
Characteristic
2
Symbol
Max
Unit
SOT−23 (TO−236)
CASE 318
Total Device Dissipation FR−5 Board
(Note 1)
P
225
mW
D
STYLE 12
T
A
= 25°C
1.8
mW/°C
°C/W
Derate above 25°C
MARKING DIAGRAM
Thermal Resistance,
R
q
556
JA
Junction−to−Ambient
A1 M G
Total Device Dissipation
Alumina Substrate,
P
D
300
2.4
mW
G
mW/°C
(Note 2) T = 25°C
A
1
Derate above 25°C
A1
M
G
= Device Code
= Date Code*
= Pb−Free Package
Thermal Resistance,
Junction−to−Ambient
R
417
°C/W
°C
q
JA
Junction and Storage Temperature
T , T
J
−55 to
+150
stg
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.
ORDERING INFORMATION
2. Alumina = 0.4 ꢀ 0.3 ꢀ 0.024 in. 99.5% alumina.
3. Square Wave; T = 25°C.
j
†
Device
Package
Shipping
BAW56LT1G
SOT−23
3000 / Tape & Reel
(Pb−Free)
BAW56LT3G
SOT−23
10,000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
August, 2009 − Rev. 6
BAW56LT1/D