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BAW56LT1D PDF预览

BAW56LT1D

更新时间: 2024-11-09 06:41:31
品牌 Logo 应用领域
安森美 - ONSEMI 二极管开关
页数 文件大小 规格书
4页 120K
描述
Dual Switching Diode Common Anode

BAW56LT1D 数据手册

 浏览型号BAW56LT1D的Datasheet PDF文件第2页浏览型号BAW56LT1D的Datasheet PDF文件第3页浏览型号BAW56LT1D的Datasheet PDF文件第4页 
BAW56LT1G  
Dual Switching Diode  
Common Anode  
Features  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
http://onsemi.com  
Compliant  
MAXIMUM RATINGS (EACH DIODE)  
CATHODE  
1
Rating  
Reverse Voltage  
Symbol  
Value  
70  
Unit  
V
ANODE  
3
V
R
2
Forward Current  
I
200  
500  
mA  
mA  
F
CATHODE  
Peak Forward Surge Current  
I
FM(surge)  
NonRepetitive Peak Forward Current  
t = 1 ms (Note 3)  
I
FSM  
3
4
A
1
THERMAL CHARACTERISTICS  
Characteristic  
2
Symbol  
Max  
Unit  
SOT23 (TO236)  
CASE 318  
Total Device Dissipation FR5 Board  
(Note 1)  
P
225  
mW  
D
STYLE 12  
T
A
= 25°C  
1.8  
mW/°C  
°C/W  
Derate above 25°C  
MARKING DIAGRAM  
Thermal Resistance,  
R
q
556  
JA  
JunctiontoAmbient  
A1 M G  
Total Device Dissipation  
Alumina Substrate,  
P
D
300  
2.4  
mW  
G
mW/°C  
(Note 2) T = 25°C  
A
1
Derate above 25°C  
A1  
M
G
= Device Code  
= Date Code*  
= PbFree Package  
Thermal Resistance,  
JunctiontoAmbient  
R
417  
°C/W  
°C  
q
JA  
Junction and Storage Temperature  
T , T  
J
55 to  
+150  
stg  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 0.75 0.062 in.  
ORDERING INFORMATION  
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.  
3. Square Wave; T = 25°C.  
j
Device  
Package  
Shipping  
BAW56LT1G  
SOT23  
3000 / Tape & Reel  
(PbFree)  
BAW56LT3G  
SOT23  
10,000 / Tape & Reel  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
August, 2009 Rev. 6  
BAW56LT1/D  
 

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