ON Semiconductort
Switching Diode
BAS16LT1
ON Semiconductor Preferred Device
MAXIMUM RATINGS
Rating
Symbol
Value
75
Unit
Vdc
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
THERMAL CHARACTERISTICS
Characteristic
V
R
3
I
F
200
500
mAdc
mAdc
1
I
FM(surge)
2
Symbol
Max
Unit
CASE 318–08, STYLE 8
SOT–23 (TO–236AB)
(1)
Total Device Dissipation FR–5 Board
P
D
225
mW
T = 25°C
A
Derate above 25°C
1.8
556
300
mW/°C
°C/W
mW
Thermal Resistance, Junction to Ambient
R
q
JA
Total Device Dissipation
P
D
(2)
Alumina Substrate, T = 25°C
A
3
1
Derate above 25°C
2.4
417
mW/°C
°C/W
°C
CATHODE
ANODE
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
DEVICE MARKING
R
q
JA
T , T
–55 to +150
J
stg
BAS16LT1 = A6
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Max
Unit
Reverse Voltage Leakage Current
I
R
µAdc
(V = 75 Vdc)
—
—
—
1.0
50
30
R
(V = 75 Vdc, T = 150°C)
R
J
(V = 25 Vdc, T = 150°C)
R
J
Reverse Breakdown Voltage
(I = 100 µAdc)
BR
V
75
—
Vdc
mV
(BR)
Forward Voltage
V
F
(I = 1.0 mAdc)
—
—
—
—
715
855
1000
1250
F
(I = 10 mAdc)
F
(I = 50 mAdc)
F
(I = 150 mAdc)
F
Diode Capacitance
(V = 0, f = 1.0 MHz)
R
C
—
—
—
—
2.0
1.75
6.0
45
pF
Vdc
ns
D
Forward Recovery Voltage
V
FR
(I = 10 mAdc, t = 20 ns)
F
r
Reverse Recovery Time
(I = I = 10 mAdc, R = 50 Ω)
t
rr
F
R
L
Stored Charge
(I = 10 mAdc to V = 5.0 Vdc, R = 500 Ω)
Q
pC
S
F
R
L
1. FR–5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.
2. Alumina = 0.4 ꢀ 0.3 ꢀ 0.024 in. 99.5% alumina.
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
March, 2001 – Rev. 1
BAS16LT1/D