Datasheet > BAS16LTH

BAS16LTH

更新时间： 2024-11-19 14:54:51

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
5页	117K
描述
Small Signal Switching Diode with TJ max. = 175 °C

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BAS16LTH 数据手册

BAS16LTH

Vishay Semiconductors

www.vishay.com

Small Signal Switching Diode with T_Jmax. = 175 °C

FEATURES

Available

• T_jmax. = 175 °C, rated for high temperature,

mission critical applications

• Fast switching diode

• Leadless ultra small DFN1006-2A package

(1 mm × 0.6 mm × 0.45 mm)

• Power dissipation better than SOT-23

• Surface-mounted device (SMD) plastic package

with visible and sidewall plated / wettable flanks

LINKS TO ADDITIONAL RESOURCES

• Soldering can be checked by standard visual

inspection. No X-ray inspection necessary to

meet automotive AOI requirements

3D Models

Models

Application

Notes

• AEC-Q101 qualified available

MECHANICAL DATA

Case: DFN1006-2A

Weight: 0.83 mg

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Molding compound flammability rating: UL 94 V-0

Terminals: high temperature soldering guaranteed:

Peak temperature max. 260 °C

Packaging codes / options:

08/10K per 7" reel (8 mm tape)

PARTS TABLE

PART

ORDERING CODE

BAS16LTH-G3-08

BAS16LTH-HG3-08

AEC-Q101 QUALIFIED

CIRCUIT CONFIGURATION

TYPE MARKING

REMARKS

BAS16LTH

Single

Tape and reel

yes

ABSOLUTE MAXIMUM RATINGS (T_amb= 25 °C, unless otherwise specified)

PARAMETER

Reverse voltage

Forward current

TEST CONDITION

SYMBOL

VALUE

UNIT

V_R

I_F

100

250

on FR-4 board with recommended soldering footprint

t_p= 1 μs

t_p= 1 ms

Non repetitive forward current ⁽¹⁾

I_FSM

1.7

t_p= 1 s

0.5

Repetitive peak forward current

Power dissipation

T_L= 100 °C, t_p= ≤ 1 ms, D = 0.05

on FR-4 board with recommended soldering footprint

I_FRM

P_tot

500

350

1500

R_thJL= 100 K/W

Note

(1)

Square wave, T_J= 25 °C prior to surge

THERMAL CHARACTERISTICS (T_amb= 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

Thermal resistance junction to

ambient air

according to JEDEC^®51-3 on FR-4 board with

recommended soldering footprint

R_thJA

420

K/W

Thermal resistance junction to lead

Maximum junction temperature

Storage temperature range

R_thJL

T_{J max.}

T_stg

100

175

K/W

°C

-55 to +175

°C

Operating temperature range

T_op

Rev. 1.0, 01-Jul-2022

Document Number: 86327

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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