PD - 96325
AUTOMOTIVE GRADE
AUIRFB4610
AUIRFS4610
HEXFET® Power MOSFET
Features
Advanced Process Technology
Ultra Low On-Resistance
D
S
V(BR)DSS
RDS(on) typ.
max.
100V
11m
14m
73A
Enhanced dV/dT and dI/dT capability
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
G
ID
D
Description
D
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to achieve
extremely low on-resistance per silicon area. Additional features of
this design are a 175°C junction operating temperature, fast
switching speed and improved repetitive avalanche rating . These
features combine to make this design an extremely efficient and
reliable device for use in Automotive applications and a wide variety
of other applications.
S
S
D
D
G
G
D2Pak
AUIRFS4610
TO-220AB
AUIRFB4610
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
Parameter
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
73
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
52
A
290
PD @TC = 25°C
190
Maximum Power Dissipation
Linear Derating Factor
W
W/°C
V
1.3
VGS
EAS
IAR
± 20
370
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally limited)
Avalanche Current
mJ
A
See Fig. 14, 15, 16a, 16b,
EAR
dV/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery
mJ
V/ns
7.6
-55 to + 175
Operating Junction and
TSTG
°C
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Mounting torque, 6-32 or M3 screw
300
10lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
Max.
0.77
–––
62
Units
RθJC
RθCS
RθJA
RθJA
Junction-to-Case
Case-to-Sink, Flat Greased Surface , TO-220
0.50
–––
°C/W
Junction-to-Ambient, TO-220
Junction-to-Ambient (PCB Mount) , D2Pak
–––
40
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
07/20/10