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APT43GA90BD30 PDF预览

APT43GA90BD30

更新时间: 2024-02-18 17:49:46
品牌 Logo 应用领域
美高森美 - MICROSEMI 双极性晶体管
页数 文件大小 规格书
9页 235K
描述
High Speed PT IGBT

APT43GA90BD30 数据手册

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APT43GA90BD30  
900V  
High Speed PT IGBT  
POWER MOS 8® is a high speed Punch-Through switch-mode IGBT. Low Eoff is achieved  
through leading technology silicon design and lifetime control processes. A reduced Eoff  
-
VCE(ON) tradeoff results in superior efciency compared to other IGBT technologies. Low  
APT43GA90B  
gate charge and a greatly reduced ratio of Cres/Cies provide excellent noise immunity, short  
delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the  
poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even  
when switching at high frequency.  
G
C
E
Combi (IGBT and Diode)  
FEATURES  
TYPICAL APPLICATIONS  
• Fast switching with low EMI  
• Very Low Eoff for maximum efciency  
• Ultra low Cres for improved noise immunity  
• Low conduction loss  
• ZVS phase shifted and other full bridge  
• Half bridge  
• High power PFC boost  
• Welding  
• Low gate charge  
• UPS, solar, and other inverters  
• High frequency, high efciency industrial  
• Increased intrinsic gate resistance for low EMI  
• RoHS compliant  
Absolute Maximum Ratings  
Symbol Parameter  
Ratings  
Unit  
Collector Emitter Voltage  
900  
V
Vces  
IC1  
Continuous Collector Current @ TC = 25°C  
Continuous Collector Current @ TC = 100°C  
Pulsed Collector Current 1  
78  
43  
A
IC2  
ICM  
129  
VGE  
Gate-Emitter Voltage 2  
±30  
V
PD  
Total Power Dissipation @ TC = 25°C  
Switching Safe Operating Area @ TJ = 150°C  
Operating and Storage Junction Temperature Range  
337  
W
SSOA  
TJ, TSTG  
TL  
129A @ 900V  
-55 to 150  
°C  
Unit  
V
Lead Temperature for Soldering: 0.063" from Case for 10 Seconds  
300  
Static Characteristics  
Symbol Parameter  
T = 25°C unless otherwise specied  
J
Test Conditions  
Min  
Typ  
Max  
VBR(CES)  
Collector-Emitter Breakdown Voltage  
VGE = 0V, IC = 1.0mA  
900  
TJ = 25°C  
TJ = 125°C  
2.5  
2.2  
4.5  
3.1  
VGE = 15V,  
IC = 47A  
VCE(on)  
VGE(th)  
ICES  
Collector-Emitter On Voltage  
Gate Emitter Threshold Voltage  
Zero Gate Voltage Collector Current  
Gate-Emitter Leakage Current  
VGE =VCE , IC = 1mA  
3
6
TJ = 25°C  
350  
VCE = 900V,  
VGE = 0V  
μA  
TJ = 125°C  
1500  
±100  
IGES  
VGS = ±30V  
nA  
Thermal and Mechanical Characteristics  
Symbol Characteristic  
Min  
Typ  
Max  
0.37  
0.80  
-
Unit  
RθJC  
RθJC  
Junction to Case Thermal Resistance (IGBT)  
Junction to Case Thermal Resistance (Diode)  
Package Weight  
-
-
-
-
-
°C/W  
WT  
5.9  
g
Torque  
Mounting Torque (TO-247 Package), 4-40 or M3 screw  
in·lbf  
10  
Microsemi Website - http://www.microsemi.com  

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