June 2000
Revised August 2001
74LVTH162374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
and 25Ω Series Resistors in the Outputs
General Description
Features
■ Input and output interface capability to systems at
The LVTH162374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
5V VCC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs
■ Live insertion/extraction permitted
■ Power Up/Power Down high impedance provides
glitch-free bus loading
The LVTH162374 is designed with equivalent 25Ω series
resistance in both the HIGH and LOW states of the output.
This design reduces line noise in applications such as
memory address drivers, clock drivers, and bus transceiv-
ers/transmitters.
■ Outputs include equivalent series resistance of 25Ω to
make external termination resistors unnecessary and
reduce overshoot and undershoot
■ Functionally compatible with the 74 series 16374
■ Latch-up performance exceeds 500 mA
■ ESD performance:
The LVTH162374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) VCC
Human-body model > 2000V
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVTH162374 is fabricated
with an advanced BiCMOS technology to achieve high
speed operation similar to 5V ABT while maintaining a low
power dissipation.
Machine model > 200V
Charged-device model > 1000V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Package
Order Number
Package Description
Number
74LVTH162374GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LVTH162374MEA
74LVTH162374MEX
74LVTH162374MTD
74LVTH162374MTX
MS48A
MS48A
MTD48
MTD48
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBES]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBES]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Note 1: BGA package available in Tape and Reel only.
© 2001 Fairchild Semiconductor Corporation
DS500355
www.fairchildsemi.com