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2SC5906(TE85L,F) PDF预览

2SC5906(TE85L,F)

更新时间: 2024-11-11 21:00:23
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 169K
描述
TRANSISTOR,BJT,NPN,30V V(BR)CEO,4A I(C),SOT-23

2SC5906(TE85L,F) 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
风险等级:5.58最大集电极电流 (IC):4 A
配置:Single最小直流电流增益 (hFE):200
最高工作温度:150 °C极性/信道类型:NPN
最大功率耗散 (Abs):1.25 W子类别:Other Transistors
表面贴装:YESBase Number Matches:1

2SC5906(TE85L,F) 数据手册

 浏览型号2SC5906(TE85L,F)的Datasheet PDF文件第2页浏览型号2SC5906(TE85L,F)的Datasheet PDF文件第3页浏览型号2SC5906(TE85L,F)的Datasheet PDF文件第4页浏览型号2SC5906(TE85L,F)的Datasheet PDF文件第5页 
2SC5906  
TOSHIBA Transistor Silicon NPN Epitaxial Type  
2SC5906  
High-Speed Switching Applications  
Unit: mm  
DC-DC Converter Applications  
Strobe Applications  
High DC current gain: h  
= 200 to 500 (I = 0.5 A)  
FE C  
Low collector-emitter saturation voltage: V  
= 0.2 V (max)  
CE (sat)  
High-speed switching: t = 25 ns (typ.)  
f
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
50  
V
V
V
V
CBO  
Collector-emitter voltage  
Collector-emitter voltage  
Emitter-base voltage  
V
50  
CEX  
CEO  
EBO  
V
V
30  
7
DC  
I
4
7
C
Collector current  
Base current  
A
A
JEDEC  
JEITA  
Pulse  
I
CP  
I
0.4  
B
TOSHIBA  
2-3S1C  
DC  
0.8  
Collector power  
dissipation  
W
P
(Note 1)  
C
t = 10 s  
1.25  
150  
Weight: 0.01 g (typ.)  
Junction temperature  
T
j
°C  
°C  
Storage temperature range  
T
55 to 150  
stg  
Note 1: Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)  
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2006-11-13  

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