2N7002K
Vishay Siliconix
SPECIFICATIONS T = 25 °C, unless otherwise noted
A
Limits
Typ.a
Parameter
Symbol
Test Conditions
Min.
Max.
Unit
Static
VDS
VGS = 0 V, ID = 10 µA
Drain-Source Breakdown Voltage
60
1
V
VGS(th)
VDS = VGS, ID = 250 µA
Gate-Threshold Voltage
Gate-Body Leakage
2.5
10
VDS = 0 V, VGS
DS = 0 V, VGS
=
=
=
20 V
15 V
10 V
µA
nA
V
1
IGSS
V
DS = 0 V, VGS
150
1000
100
1
V
DS = 0 V, VGS
=
10 V, TJ = 85 °C
5 V
VDS = 60 V, VGS = 0 V
V
DS = 0 V, VGS =
IDSS
Zero Gate Voltage Drain Current
On-State Drain Currenta
µA
mA
Ω
V
DS = 60 V, VGS = 0 V , TJ = 125 °C
VGS = 10 V, VDS = 7.5 V
500
800
500
ID(on)
V
GS = 4.5 V, VDS = 10 V
VGS = 10 V, ID = 500 mA
GS = 4.5 V, ID = 200 mA
2
4
Drain-Source On-Resistancea
RDS(on)
V
Forward Transconductancea
Diode Forward Voltage
gfs
VDS = 10 V, ID = 200 mA
IS = 200 mA, VGS = 0 V
100
mS
V
VSD
1.3
0.6
Dynamica
VDS = 10 V, VGS = 4.5 V
Qg
Total Gate Charge
0.4
nC
pF
ID ≅ 250 mA
Ciss
Coss
Crss
Input Capacitance
30
6
VDS = 25 V, VGS = 0 V
f = 1 MHz
Output Capacitance
Reverse Transfer Capacitance
2.5
Switchinga, b, c
Turn-On Time
Turn-Off Time
td(on)
td(off)
25
35
VDD = 30 V, RL = 150 Ω
ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω
ns
Notes:
a. For DESIGN AID ONLY, not subject to production testing.
b. Pulse test: PW ≤ 300 µs duty cycle ≤ 2 %.
c. Switching time is essentially independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Document Number: 71333
S09-0857-Rev. E, 18-May-09