2N7002KW
N-Channel Enhancement
Mode Field Effect
Transistor
Features
www.onsemi.com
• Low On−Resistance
• Low Gate Threshold Voltage
• Low Input Capacitance
D
• Fast Switching Speed
S
• Low Input/Output Leakage
• Ultra−Small Surface Mount Package
• These Devices are Pb−Free and are RoHS Compliant
• ESD HBM = 1000 V as per JESD22 A114 and ESD CDM = 1500 V
as per JESD22 C101
G
SC−70
3 LEAD
CASE 419AB
MARKING DIAGRAM
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Rating
Drain−Source Voltage
Symbol
Value
60
Unit
V
7KW
V
DSS
GSS
Gate−Source Voltage
V
20
V
7KW = Specific Device Marking
D
Maximum Drain Current
Continuous
I
310
195
1.2
mA
mA
A
D
T = 100°C
J
Pulsed
Operating Junction Temperature Range
Storage Temperature Range
T
−55 to
+150
°C
J
T
−55 to
+150
°C
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
G
S
THERMAL CHARACTERISTICS
Parameter
Symbol
Value
Unit
ORDERING INFORMATION†
Total Device Dissipation
P
300
2.4
mW
D
Derating above T = 25°C
mW/°C
A
†
Device
2N7002KW
Package
Shipping
Thermal Resistance,
Junction to Ambient*
R
410
°C/W
q
JA
SC−70
3000 / Tape &
Reel
*Device mounted on FR−4 PCB, 1″ x 0.85″ x 0.062″. Minimum land pad size
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
May, 2018 − Rev. 1
2N7002KW/D