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2N7002KW PDF预览

2N7002KW

更新时间: 2024-11-18 07:29:15
品牌 Logo 应用领域
SECOS 晶体晶体管开关光电二极管PC
页数 文件大小 规格书
4页 527K
描述
N-Ch Small Signal MOSFET with ESD Protection

2N7002KW 技术参数

生命周期:Contact ManufacturerReach Compliance Code:compliant
风险等级:5.17配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (ID):0.115 A
最大漏源导通电阻:3 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):5 pFJESD-30 代码:R-PDSO-G3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL表面贴装:YES
端子形式:GULL WING端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

2N7002KW 数据手册

 浏览型号2N7002KW的Datasheet PDF文件第2页浏览型号2N7002KW的Datasheet PDF文件第3页浏览型号2N7002KW的Datasheet PDF文件第4页 
2N7002KW  
115mA , 60V, RDS(ON) 4  
N-Ch Small Signal MOSFET with ESD Protection  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen & lead-free  
FEATURES  
SOT-323  
RDS(ON), VGS@10V, IDS@500mA=3  
RDS(ON), VGS@4.5V, IDS@200mA=4  
A
Advanced Trench Process Technology  
L
High Density Cell Design For Ultra Low On-Resistance  
Very Low Leakage Current In Off Condition  
Specially Designed for Battery Operated Systems,  
Solid-State Relays DriversRelays, Displays, Lamps,  
Solenoids, Memories, etc.  
3
3
Top View  
C B  
1
1
2
2
K
F
E
ESD Protected 2KV HBM  
In compliance with EU RoHS 2002/95/EC directives  
D
H
G
J
MECHANICAL DATA  
Case: SOT-323 Package  
Terminals: Solderable per MIL-STD-750,  
Method 2026  
Millimeter  
Min. Max.  
Millimeter  
REF.  
REF.  
Min.  
Max.  
0.100 REF.  
0.525 REF.  
A
B
C
D
E
F
1.80  
1.80  
1.15  
0.80  
1.20  
0.20  
2.20  
2.45  
1.35  
1.10  
1.40  
0.40  
G
H
J
K
L
0.08  
-
0.25  
-
MARKING  
0.650 TYP.  
K72  
Drain  
  
PACKAGE INFORMATION  
  
Gate  
Package  
MPQ  
LeaderSize  
SOT-323  
3K  
7’ inch  
  
Source  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)  
Parameter  
Symbol  
Rating  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
ID  
60  
±20  
V
V
Continuous Drain Current  
Pulsed Drain Current 1  
115  
mA  
mA  
IDM  
800  
TA=25°C  
TA=75°C  
200  
Maximum Power Dissipation  
PD  
mW  
120  
Thermal Resistance Junction-Ambient (PCB mounted) 2  
625  
°C / W  
°C  
R  
JA  
Operating Junction and Storage Temperature  
TJ, TSTG  
-55~150  
Notes:  
1. Maximum DC current limited by the package.  
2. Surface mounted on FR4 board, t < 5sec.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
31-Mar-2011 Rev. A  
Page 1 of 4  

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