2N7002CK
NXP Semiconductors
60 V, 0.3 A N-channel Trench MOSFET
Table 6.
Thermal characteristics …continued
Symbol
Parameter
Conditions
Min
Typ
Max Unit
150 K/W
Rth(j-sp)
thermal resistance from
junction to solder point
-
-
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
Static characteristics
Min
Typ
Max Unit
V(BR)DSS
drain-source breakdown ID = 10 µA; VGS = 0 V
voltage
Tj = 25 °C
60
55
1
-
-
-
-
V
V
V
Tj = −55 °C
VGS(th)
IDSS
gate-source threshold
voltage
ID = 250 µA; VDS = VGS
Tj = 25 °C
;
1.75 2.5
drain leakage current
VDS = 60 V; VGS = 0 V
Tj = 25 °C
-
-
-
-
-
-
100
1
nA
µA
µA
nA
nA
Tj = 150 °C
-
IGSS
gate leakage current
VGS = ±20 V; VDS = 0 V
VGS = ±10 V; VDS = 0 V
VGS = ±5 V; VDS = 0 V
-
5
50
-
450
100
RDSon
drain-source on-state
resistance
VGS = 4.5 V;
ID = 200 mA
Tj = 25 °C
-
-
-
1.3
2.8
1.1
3
Ω
Ω
Ω
Tj = 150 °C
4.4
1.6
VGS = 10 V; ID = 500 mA
Dynamic characteristics
QG(tot)
QGS
QGD
Ciss
total gate charge
gate-source charge
gate-drain charge
input capacitance
output capacitance
ID = 200 mA;
-
-
-
-
-
-
1.09 1.3
nC
nC
nC
pF
pF
pF
V
V
DS = 10 V;
GS = 4.5 V
0.22
0.23
-
-
VGS = 0 V; VDS = 25 V;
f = 1 MHz
47.2 55
Coss
Crss
11
5
20
reverse transfer
capacitance
7.5
td(on)
tr
td(off)
tf
turn-on delay time
rise time
VDS = 15 V;
RL = 15 Ω;
-
-
-
-
8
15
15
50
35
ns
ns
ns
ns
8
VGS = 10 V;
turn-off delay time
fall time
38
22
RG = 6 Ω
Source-drain diode
VSD source-drain voltage
IS = 200 mA; VGS = 0 V
0.47 0.79 1.1
V
2N7002CK_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 11 September 2009
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