2N7002CK
NXP Semiconductors
60 V, 0.3 A N-channel Trench MOSFET
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
60
Unit
V
VDS
VGS
ID
drain-source voltage
25 °C ≤ Tj ≤ 150 °C
-
-
gate-source voltage
drain current
±20
V
VGS = 10 V
Tamb = 25 °C
-
-
-
-
300
190
1.2
mA
mA
A
Tamb = 100 °C
Tamb = 25 °C; tp ≤ 10 µs
Tamb = 25 °C
IDM
Ptot
Tj
peak drain current
[1]
total power dissipation
junction temperature
ambient temperature
storage temperature
350
150
+150
+150
mW
°C
Tamb
Tstg
−55
−65
°C
°C
Source-drain diode
IS
source current
peak source current
Tamb = 25 °C
-
-
200
1.2
mA
A
ISM
Tamb = 25 °C; tp ≤ 10 µs
ElectroStatic Discharge (ESD)
VESD
electrostatic discharge
voltage
all pins;
-
3
kV
human body model;
C = 100 pF;
R = 1.5 kΩ
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad
for drain 1 cm2.
017aaa001
017aaa002
120
120
P
I
der
der
(%)
(%)
80
80
40
40
0
−75
0
−75
−25
25
75
125
175
(°C)
−25
25
75
125
175
(°C)
T
T
amb
amb
Ptot
-----------------------
Ptot(25°C)
ID
-------------------
ID(25°C)
Pder
=
× 100 %
Ider
=
× 100 %
Fig 1. Normalized total power dissipation as a
function of ambient temperature
Fig 2. Normalized continuous drain current as a
function of ambient temperature
2N7002CK_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 11 September 2009
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