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1N6693TX PDF预览

1N6693TX

更新时间: 2024-11-04 04:24:55
品牌 Logo 应用领域
SSDI /
页数 文件大小 规格书
2页 89K
描述
20 AMP 600-1200 Volts 75 nsec ULTRA FAST RECTIFIER

1N6693TX 技术参数

生命周期:Active包装说明:E-XALF-W2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.69应用:ULTRA FAST RECOVERY
外壳连接:ISOLATED配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:E-XALF-W2最大非重复峰值正向电流:375 A
元件数量:1相数:1
端子数量:2最大输出电流:20 A
封装主体材料:UNSPECIFIED封装形状:ELLIPTICAL
封装形式:LONG FORM认证状态:Not Qualified
最大重复峰值反向电压:1200 V最大反向恢复时间:0.075 µs
表面贴装:NO端子形式:WIRE
端子位置:AXIALBase Number Matches:1

1N6693TX 数据手册

 浏览型号1N6693TX的Datasheet PDF文件第2页 
1N6690-1N6693  
and  
1N6690US-1N6693US  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
DESIGNER’S DATA SHEET  
Part Number / Ordering Information 1/  
20 AMP  
600-1200 Volts  
75 nsec  
1N66 __ __ __  
L Screening2/ = None  
ULTRA FAST RECTIFIER  
L
L
TX = TX Level  
TXV = TXV Level  
S = S Level  
Features:  
Replaces DO-4 and DO-5  
Ultra Fast Recovery  
Package ____ = Axial  
SMS = Surface Mount Square Tab  
PIV to 1200 Volts  
Voltage  
Low Reverse Leakage  
90 = 600 V  
Hermetically Sealed Void-Free Construction3/  
Monolithic Single Chip Construction  
High Surge Rating  
91 = 800 V  
92 = 1000 V  
93 = 1200 V  
Low Thermal Resistance  
Available in Surface Mount Versions (-US Suffix) and in  
Button Tab Mounting (See Data Sheet RU0129).  
TX, TXV, and S-Level Screening Available2/  
Maximum Ratings  
Symbol  
Value  
Units  
Volts  
1N6690 & 1N6690US  
1N6691 & 1N6691US  
1N6692 & 1N6692US  
1N6693 & 1N6693US  
600  
800  
1000  
1200  
Peak Repetitive Reverse and  
DC Blocking Voltage  
VRRM  
VRWM  
VR  
Average Rectified Forward Current  
(Resistive Load, 60 Hz Sine Wave, TA = 100ºC)  
Io  
20  
Amps  
Repetitive Peak Surge Current  
(8.3 ms Pulse, Half Sine Wave Superimposed on Io, Allow Junction to  
Reach Equilibrium Between Pulses, TA = 25ºC)  
IFSM  
375  
Amps  
ºC  
Operating & Storage Temperature  
Top & Tstg  
-65 to +175  
Maximum Thermal Resistance  
Junction to Leads, L = 3/8 "  
Junction to End Tab  
RθJL  
RθJE  
3.0  
2.5  
ºC/W  
Notes:  
1/ For Ordering Information, Price, Operating Curves, and Availability – Contact Factory.  
2/ Screening Based on MIL-PRF-19500. Specifics Available on Request.  
3/ PIND Testing not Required on Void Free Devices per MIL-PRF-19500.  
Axial Leaded  
SMS  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: RU0143D  
DOC  

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