AAT7357ITS-T1 PDF预览

AAT7357ITS-T1

更新时间: 2025-08-07 06:35:51
品牌 Logo 应用领域
AAT /
页数 文件大小 规格书
6页 191K
描述
20V P-Channel Power MOSFET

AAT7357ITS-T1 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:,Reach Compliance Code:unknown
风险等级:5.61Is Samacsys:N
湿度敏感等级:1Base Number Matches:1

AAT7357ITS-T1 数据手册

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AAT7357  
20V P-Channel Power MOSFET  
General Description  
Features  
The AAT7357 is a low threshold dual P-channel  
MOSFET designed for the battery, cell phone, and  
PDA markets. Using AnalogicTech's ultra-high-  
density MOSFET process and space-saving,  
small-outline, J-lead package, performance superi-  
or to that normally found in a TSSOP-8 footprint  
has been squeezed into the footprint of a  
TSOPJW-8 package.  
Drain-Source Voltage (max): -20V  
Contiunous Drain Current1 (max) = -5A @ 25°C  
Low On-Resistance:  
— 39m@ VGS = -4.5V  
— 63m@ VGS = -2.5V  
Dual TSOPJW-8 Package  
Top View  
D1 D1 D2 D2  
Applications  
8
7
6
5
Battery Packs  
Battery-Powered Portable Equipment  
Cellular and Cordless Telephones  
1
2
3
4
S1 G1 S2 G2  
Absolute Maximum Ratings  
TA = 25°C, unless otherwise noted.  
Symbol  
Description  
Value  
Units  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
-20  
±12  
V
TA = 25°C  
TA = 70°C  
±5  
ID  
Continuous Drain Current @ TJ = 150°C1  
±4  
A
IDM  
IS  
Pulsed Drain Current2  
Continuous Source Current (Source-Drain Diode)1  
±12  
-1.3  
TA = 25°C  
TA = 70°C  
1.6  
PD  
Maximum Power Dissipation1  
W
1.0  
TJ  
Operating Junction Temperature Range  
Storage Temperature Range  
-55 to 150  
-55 to 150  
°C  
°C  
TSTG  
Thermal Characteristics1  
Symbol  
Description  
Typ  
Max  
Units  
RθJA  
RθJA2  
RθJF  
Junction-to-Ambient Steady State, One FET On  
Junction-to-Ambient t<5 Seconds  
Junction-to-Foot  
115  
64  
140  
78  
°C/W  
°C/W  
°C/W  
60  
72  
1. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 5-second pulse on a  
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. RθJF + RθFA = RθJA where the  
foot thermal reference is defined as the normal solder mounting surface of the device's leads. RθJF is guaranteed by design; however,  
RθCA is determined by the PCB design. Actual maximum continuous current is limited by the application's design.  
2. Pulse test: Pulse Width = 300µs.  
7357.2005.04.1.0  
1

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