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AAT7551IJS-T1 PDF预览

AAT7551IJS-T1

更新时间: 2024-01-03 16:04:40
品牌 Logo 应用领域
ANALOGICTECH /
页数 文件大小 规格书
6页 103K
描述
20V P-Channel Power MOSFET

AAT7551IJS-T1 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.81Is Samacsys:N
湿度敏感等级:1Base Number Matches:1

AAT7551IJS-T1 数据手册

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AAT7551  
20V P-Channel Power MOSFET  
General Description  
Features  
The AAT7551 is a dual low threshold P-channel  
MOSFET designed for the battery, cell phone, and  
PDA markets. Using AnalogicTech's ultra-high-  
density MOSFET process and space-saving,  
small outline, J-lead package, performance supe-  
rior to that normally found in a TSOP-6 footprint  
has been squeezed into the footprint of an  
SC70JW-8 package.  
Drain-Source Voltage (max): -20V  
Continuous Drain Current1 (max):  
-2.7A @ 25°C  
Low On-Resistance:  
— 100m@ VGS = -4.5V  
— 175m@ VGS = -2.5V  
Dual SC70JW-8 Package  
Applications  
Top View  
D1 D1 D2 D2  
Battery Packs  
Battery-Powered Portable Equipment  
Cellular and Cordless Telephones  
8
7
6
5
Absolute Maximum Ratings  
TA = 25°C, unless otherwise noted.  
1
2
3
4
S1 G1 S2 G2  
Symbol  
Description  
Value  
Units  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
-20  
V
±12  
TA = 25°C  
±2.7  
±2.2  
ID  
Continuous Drain Current @ TJ = 150°C1  
TA = 70°C  
A
IDM  
IS  
Pulsed Drain Current2  
±8  
Continuous Source Current (Source-Drain Diode)1  
Operating Junction Temperature Range  
Storage Temperature Range  
-0.6  
TJ  
-55 to 150  
-55 to 150  
°C  
°C  
TSTG  
Thermal Characteristics1  
Symbol  
Description  
Typ  
Max  
Units  
RθJA  
RθJA2  
RθJF  
Junction-to-Ambient Steady State  
Junction-to-Ambient t<5 Seconds  
Junction-to-Foot  
132  
83  
165  
104  
72  
°C/W  
60  
TA = 25°C  
TA = 70°C  
1.2  
PD  
Maximum Power Dissipation  
W
0.75  
1. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 5-second pulse on a  
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. RθJF + RθFA = RθJA where  
the foot thermal reference is defined as the normal solder mounting surface of the device's leads. RθJF is guaranteed by design;  
however, RθCA is determined by the PCB design. Actual maximum continuous current is limited by the application's design.  
2. Pulse test: Pulse Width = 300µs.  
7551.2005.04.1.0  
1

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