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AAT8107IAS-T1 PDF预览

AAT8107IAS-T1

更新时间: 2024-02-23 17:38:54
品牌 Logo 应用领域
ANALOGICTECH /
页数 文件大小 规格书
6页 113K
描述
20V P-Channel Power MOSFET

AAT8107IAS-T1 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.84配置:Single
最大漏极电流 (Abs) (ID):6.5 A最大漏极电流 (ID):6.5 A
FET 技术:METAL-OXIDE SEMICONDUCTOR工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):2.5 W子类别:Other Transistors
表面贴装:YES

AAT8107IAS-T1 数据手册

 浏览型号AAT8107IAS-T1的Datasheet PDF文件第2页浏览型号AAT8107IAS-T1的Datasheet PDF文件第3页浏览型号AAT8107IAS-T1的Datasheet PDF文件第4页浏览型号AAT8107IAS-T1的Datasheet PDF文件第5页浏览型号AAT8107IAS-T1的Datasheet PDF文件第6页 
AAT8107  
20V P-Channel Power MOSFET  
TrenchDMOS  
General Description  
Features  
The AAT8107 low threshold 20V, P-channel MOS-  
FET is a member of AnalogicTech's TrenchDMOS  
product family. Using an ultra-high density propri-  
etary TrenchDMOS technology, the AAT8107 is  
designed for use as a load switch in battery-pow-  
ered applications and protection in battery packs.  
VDS(MAX) = -20V  
ID(MAX) = -6.5A @ 25°C  
1
Low RDS(ON)  
:
35m@ VGS = -4.5V  
60m@ VGS = -2.5V  
SOP-8L Package  
Applications  
Top View  
Battery Packs  
Battery-Powered Portable Equipment  
D
8
D
D
D
5
7
6
1
2
3
4
Absolute Maximum Ratings  
TA = 25°C, unless otherwise noted.  
S
S
S
G
Symbol  
Description  
Value  
Units  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
-20  
±12  
V
TA = 25°C  
TA = 70°C  
±6.5  
ID  
Continuous Drain Current @ TJ=150°C1  
±5.2  
A
IDM  
IS  
Pulsed Drain Current2  
Continuous Source Current (Source-Drain Diode)1  
±32  
-1.7  
TA = 25°C  
TA = 70°C  
2.5  
PD  
Maximum Power Dissipation1  
W
1.6  
TJ, TSTG  
Operating Junction and Storage Temperature Range  
-55 to 150  
°C  
Thermal Characteristics  
Symbol  
Description  
Value  
Units  
RθJA  
RθJA2  
RθJF  
Typical Junction-to-Ambient Steady State1  
Maximum Junction-to-Ambient t<10 Seconds1  
Typical Junction-to-Foot1  
80  
50  
27  
°C/W  
1. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 10-second pulse on a  
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. RθJF + RθFA = RθJA where the  
foot thermal reference is defined as the normal solder mounting surface of the device's leads. RθJF is guaranteed by design; however,  
RθCA is determined by the PCB design. Actual maximum continuous current is limited by the application's design.  
2. Pulse test: Pulse Width = 300µs.  
8107.2005.05.1.1  
1

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