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ZVN4210G PDF预览

ZVN4210G

更新时间: 2024-11-30 07:42:43
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管功率场效应晶体管脉冲光电二极管
页数 文件大小 规格书
3页 41K
描述
SOT223 N-CHANNEL ENHANCEMENT MODE VERTICAL DMOS FET

ZVN4210G 技术参数

是否Rohs认证:符合生命周期:Active
零件包装代码:SOT-223包装说明:SMALL OUTLINE, R-PDSO-G4
针数:4Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.75
风险等级:5.12Is Samacsys:N
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):0.8 A
最大漏极电流 (ID):0.8 A最大漏源导通电阻:1.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G4
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):2 W最大脉冲漏极电流 (IDM):6 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管元件材料:SILICON
Base Number Matches:1

ZVN4210G 数据手册

 浏览型号ZVN4210G的Datasheet PDF文件第2页浏览型号ZVN4210G的Datasheet PDF文件第3页 
SOT223 N-CHANNEL ENHANCEMENT  
MODE VERTICAL DMOS FET  
ZVN4210G  
ISSUE 2 - NOVEMBER 1995  
FEATURES  
D
*
Low RDS(on) = 1.5  
PARTMARKING DETAIL - ZVN4210  
S
D
G
ABSOLUTE MAXIMUM RATINGS.  
PARAMETER  
S YMBOL  
VDS  
VALUE  
UNIT  
V
Dra in -S o u rce Vo lta g e  
100  
Co n tin u o u s Drain Cu rren t at Ta m b=25°C  
Pu ls ed Dra in Cu rre n t  
ID  
0.8  
A
IDM  
6
A
Ga te-S o u rce Vo lta g e  
VGS  
V
± 20  
2
Po w er Dis s ip a tio n a t Ta m b=25°C  
Op e ratin g a n d S to ra g e Te m p e ratu re Ra n g e  
Pto t  
W
Tj:Ts tg  
-55 to +150  
°C  
ELECTRICAL CHARACTERISTICS (at T  
= 25°C unless otherw ise stated).  
am b  
PARAMETER  
S YMBOL MIN. MAX. UNIT CONDITIONS .  
Dra in -S o u rce Bre akd o w n  
Vo lta g e  
BVDS S  
100  
V
ID=1m A, VGS=0V  
Gate-Sou rce Threshold Voltage VGS (th )  
0.8  
2.4  
V
ID=1m A, VDS= VGS  
Ga te-Bo d y Lea ka g e  
IGS S  
IDS S  
100  
n A  
V
GS=± 20V, VDS=0V  
Ze ro Ga te Vo lta g e Dra in  
Cu rre n t  
10  
100  
VDS=100V, VGS=0  
VDS=80V, VGS=0V, T=125°C(2)  
µA  
µA  
On -S ta te Dra in Cu rre n t(1)  
ID(o n )  
2.5  
A
VDS=25V, VGS=10V  
VGS=10V,ID=1.5A  
S tatic Drain -S o u rce On -S ta te  
Res ista n ce (1)  
RDS (o n )  
1.5  
1.8  
VGS=5V,ID=500m A  
Forward Transconductance(1)(2) g fs  
250  
m S  
p F  
p F  
VDS=25V,ID=1.5A  
In p u t Ca p a cita n ce (2)  
Cis s  
Co s s  
100  
40  
Co m m o n S o u rce Ou tp u t  
Cap acita n ce (2)  
VDS=25V, VGS=0V, f=1MHz  
Reverse Transfer Capacitance (2) Crs s  
12  
4
p F  
n s  
n s  
n s  
n s  
Tu rn -On De la y Tim e (2)(3)  
Ris e Tim e (2)(3)  
td (o n )  
tr  
8
VDD25V, ID=1.5A  
Tu rn -Off De la y Tim e (2)(3)  
Fa ll Tim e (2)(3)  
td (o ff)  
tf  
20  
30  
(1) Measured under pulsed conditions. Width=300µs. Duty cycle 2% (2) Sam ple test.  
(3) Switching tim es m easured with 50source im pedance and <5ns rise tim e on a pulse generator  
Spice param eter data is available upon request for this device  

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