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ZSSC3017AL2T PDF预览

ZSSC3017AL2T

更新时间： 2024-09-15 20:55:31
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
2页 885K
描述
Sensor/Transducer

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中文翻译

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ZSSC3017AL2T 技术参数

生命周期：Contact ManufacturerReach Compliance Code：compliant
风险等级：5.3Base Number Matches：1

ZSSC3017AL2T 数据手册

 浏览型号ZSSC3017AL2T的Datasheet PDF文件第2页 
ZSSC3017 ꢀ Preliminary  
16 Bit Resistive Bridge Sensor Signal Conditioner IC  
Brief Description  
Benefits  
The ZSSC3017 is a CMOS integrated circuit for  
high accuracy amplification and analogꢀtoꢀdigital  
conversion of differential input signals. Designed  
for highꢀresolution applications, the device can  
perform offset, 1st and 2nd order span, and 1st and  
2nd order temperature (Tco and Tcg) compensation  
of the measured signal. Developed for correction  
of resistive bridge sensors, the ZSSC3017 can  
also provide a corrected temperature output using  
an internal sensor measurement. The ZSSC3017’s  
analog interface is configurable for optimizing the  
ZSSC3017's signal processing for the sensor  
element. Gain and ADCꢀinput range offset (input  
offset shift) can be programmed.  
•
•
•
Integrated 18ꢀbit calibration math DSP  
Fully corrected signal at digital output  
Minimize calibration costs through the oneꢀ  
pass calibration concept  
•
•
No external trimming components required  
Highlyꢀintegrated, lowꢀcost CMOS design  
Physical Characteristics  
•
•
•
•
•
•
Operation temperature: ꢀ40 to +85 °C  
Supply voltage: 2.7 to 5.5 V  
Input sensitivity: 2.44 to 0.191 ꢁV/(V*LSB)  
Sample rate: (samples/second) 200  
Sleep Mode current: <2ꢂA (25°C)  
Digital compensation of signal offset, sensitivity,  
temperature, and nonꢀlinearity is accomplished via  
an 18ꢀbitꢀwide internal digital signal processor runꢀ  
ning a correction algorithm. Calibration coefficients  
are stored in a highly reliable nonꢀvolatile memory  
(EEPROM). Measured and corrected bridge  
values are provided at the I2C™*ꢀbased digital  
output pins. Programming the ZSSC3017 is simple  
using the serial interface and the PCꢀcontrolled  
calibration software provided in the ZMDI Developꢀ  
ment Kit. The digital mating is fast and precise,  
eliminating the overhead normally associated with  
trimming external components and multiꢀpass  
calibration routines.  
Delivery options: die for wafer bonding,  
TSSOP14 package  
Applications  
•
•
•
•
•
•
•
•
•
•
•
Pressure measurement and control  
Mobile altimeter/barometer systems  
Weather forecasting  
Sports or multiꢀmode watches  
Data merging with GPS receivers  
Medical gas control  
Heating, ventilation, air conditioning  
Medical infusion pumps  
Features  
Ambulatory nonꢀinvasive pump pressure  
Occlusion detection  
•
Flexibleꢀprogramming analog frontꢀend conꢀ  
cept; up to 16ꢀbit scalable, twoꢀstage chargeꢀ  
balancing ADC  
Robotic endꢀeffectors  
ZSSC3017 Application Example  
•
Fully programmable gain amplifier accepting  
sensor signals from 12.5 to 160mV/V  
VDD  
(2.7 to 5.5V)  
CVDD  
e.g. 100nF  
•
•
Internal autoꢀcompensated temperature sensor  
VDD  
Digital compensation of individual sensor offset;  
1st and 2nd order digital compensation of sensor  
gain  
Digital compensation of 1st and 2nd order  
temperature gain and offset drift  
VDD  
SDA  
SCL  
Signal Output /  
Postprocessing  
SDA  
SCL  
VDDA  
ZSSC3017  
VDDA  
•
INP  
Sensor  
BGND  
INN  
VDD  
(2.7 to 5.5V)  
•
•
Intelligent powerꢀmanagement unit  
dice  
Supply Control  
(optional)  
Layout customized for dieꢀdie bonding with  
sensor  
VSSA  
Sensor  
Module  
VSS  
INT  
VSS  
dice  
•
Accuracy**: ±0.50% FSO @ ꢀ40 to 85°C  
VSS  
* I2C is a registered trademark of NXP.  
** See datasheet for further details.  
© 2010 Zentrum Mikroelektronik Dresden AG — Rev. 1.2  
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.  
The information furnished in this publication is PRELIMINARY and subject to changes without notice.  
12

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