Datasheet > ZSSC3027AC6B

ZSSC3027AC6B

更新时间： 2024-01-23 07:33:59

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瑞萨 - RENESAS		/
页数	文件大小	规格书
47页	905K
描述
Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner

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ZSSC3027AC6B 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	WAFER
包装说明：	UUC,	针数：	0
Reach Compliance Code：	compliant	HTS代码：	8542.31.00.01
风险等级：	5.59	模拟集成电路 - 其他类型：	ANALOG CIRCUIT
JESD-30 代码：	R-XUUC-N17	JESD-609代码：	e3
湿度敏感等级：	1	信道数量：	1
功能数量：	1	端子数量：	19
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	UUC
封装形状：	RECTANGULAR	封装形式：	UNCASED CHIP
峰值回流温度（摄氏度）：	NOT SPECIFIED	最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	1.7 V	标称供电电压 (Vsup)：	1.8 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	Tin (Sn)
端子形式：	NO LEAD	端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

ZSSC3027AC6B 数据手册

ZSSC3027

Low-Power, High-Resolution

Datasheet

16-Bit Sensor Signal Conditioner

Brief Description

Benefits

•

Integrated 18-bit calibration math DSP

The ZSSC3027 is a sensor signal conditioner (SSC)

integrated circuit for high-accuracy amplification and

analog-to-digital conversion of a differential input

signal. Designed for high-resolution altimeter module

applications, the ZSSC3027 can perform offset,

span, and 1^stand 2^ndorder temperature compen-

sation of the measured signal. Developed for correc-

tion of resistive bridge sensors, it can also provide a

corrected temperature output measured with an

internal sensor.

Fully corrected signal at digital output

One-pass calibration minimizes calibration costs

No external trimming, filter, or buffering com-

ponents required

•

Highly integrated CMOS design

Excellent for low-voltage and low-power battery

applications

•

Optimized for operation in calibrated resistive

sensor modules

The measured and corrected bridge values are

provided at the digital output pins, which can be

configured as I²C™* (≤ 3.4MHz) or SPI (≤ 20MHz).

Digital compensation of signal offset, sensitivity,

temperature, and non-linearity is accomplished via

an 18-bit internal digital signal processor (DSP) run-

ning a correction algorithm. Calibration coefficients

are stored on-chip in a highly reliable, non-volatile,

multiple-time programmable (MTP) memory. Pro-

gramming the ZSSC3027 is simple via the serial

interface. The IC-internal charge pump provides the

MTP programming voltage. The interface is used for

the PC-controlled calibration procedure, which pro-

grams the set of calibration coefficients in memory.

Physical Characteristics

•

Supply voltage range: 1.7 to 3.6V

Operating mode current consumption:

930µA (typical)

•

Sleep State current: 20nA (typical)

Temperature resolution: <0.003K/LSB

Operation temperatures: –40°C to +85°C

Small die size

Delivery options: die for wafer bonding

Available Support

The ZSSC3027 provides accelerated signal process-

ing in order to support high-speed control, safety,

and real-time sensing applications. It complements

IDT’s ZSSC30x6 products.

•

ZSSC3026 Evaluation Kit can be used to

evaluate ZSSC3027 capabilities

•

Support Documentation

ZSSC3027 Application Example

Features

•

Flexible, programmable analog front-end design;

up to 16-bit scalable, charge-balancing two-

segment analog-to-digital converter (ADC)

•

Fully programmable gain amplifier accepting

sensors from 14 to 72 (linear factor)

•

Internal auto-compensated temperature sensor

Digital compensation of individual sensor offset;

1^stand 2^ndorder digital compensation of sensor

gain as well as of 1^stand 2^ndorder temperature

gain and offset drift

•

Layout optimized for stacked-die bonding for

high-density chip-on-board assembly

* I²C™ is a trademark of NXP.

** FSO = Full Scale Output.

Typical sensor elements can achieve accuracy of

better than ±0.10% FSO** @ -40 to 85°C

April 20, 2016

12 3 4 5 6 7...47

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