ZSSC3036
Low-Power, High-Resolution 16-Bit
Sensor Signal Conditioner
Datasheet
Brief Description
Benefits
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•
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Integrated 18-bit calibration math DSP
The ZSSC3036 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3036 can perform offset,
span, and 1st and 2nd order temperature compen-
sation of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
Fully corrected signal at digital output
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
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Single-pass calibration minimizes calibration
costs
No external trimming, filter, or buffering com-
ponents required
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Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I2C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3036 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which pro-
grams the set of calibration coefficients in memory.
The ZSSC3036 provides accelerated signal process-
ing in order to support high-speed control, safety,
and real-time sensing applications. It complements
IDT’s additional ZSSC30x6 products.
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Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
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Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
–40°C to +110°C
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Small die size
Delivery options: die for wafer bonding
* I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
Features
ZSSC3036 Application Example
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Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
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Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
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Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain as well as of 1st and 2nd order temperature
gain and offset drift
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Fast sensing: 16-bit conditioned sensor signal
measurement rate at more than 200s-1
Typical sensor elements can achieve accuracy of
less than ±0.10% FSO** @ -40 to 110°C
© 2016 Integrated Device Technology, Inc.
1
April 20, 2016
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