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ZSSC3026CI1B PDF预览

ZSSC3026CI1B

更新时间: 2022-02-26 11:18:05
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
51页 710K
描述
Low Power, High Resolution 16-Bit Sensor Signal Conditioner

ZSSC3026CI1B 数据手册

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ZSSC3026  
Low Power, High Resolution 16-Bit  
Sensor Signal Conditioner  
Datasheet  
Brief Description  
Benefits  
The ZSSC3026 is a sensor signal conditioner (SSC)  
integrated circuit for high-accuracy amplification and  
analog-to-digital conversion of a differential input  
signal. Developed for correction of resistive bridge  
sensors and optimized for high-resolution altimeter  
module applications, the ZSSC3026 can perform  
offset, span, and 1st and 2nd order temperature com-  
pensation of the measured signal. It can also provide  
a corrected temperature output measured with an  
internal sensor. The corrected measurement values  
are provided at the digital output pins, which can be  
configured as I2C™* (3.4MHz) or SPI (20MHz).  
Excellent for low-voltage and low-power battery  
applications  
Integrated 18-bit calibration math DSP  
Costs minimized via one-pass calibration  
No external trimming components required  
Highly integrated CMOS design  
Physical Characteristics  
Supply voltage range: 1.8 to 3.6V  
Current consumption: 900µA (operating mode)  
Sleep State current: 50nA (typical)  
Digital compensation of the signal offset, sensitivity,  
temperature, and non-linearity is accomplished via  
an 18-bit internal digital signal processor (DSP) run-  
ning a correction algorithm. Calibration coefficients  
are stored on-chip in a highly reliable, non-volatile,  
multiple-time programmable (MTP) memory. Prog-  
ramming the ZSSC3026 is simple via the serial  
interface. An internal charge pump provides the  
programming voltage. The interface is used for the  
PC-controlled calibration procedure, which programs  
the calibration coefficients in memory. The digital  
mating is fast and precise, eliminating the overhead  
normally associated with trimming external com-  
ponents and multi-pass calibration routines.  
Temperature resolution: <0.003K/LSB  
Operation temperatures depending on part  
number: –40°C to +85°C  
Small die size  
Delivery options: die for wafer bonding, bumped  
die for Flip Chip, PQFN24  
Typical Applications  
The ZSSC3026 is designed for operation in cali-  
brated resistive (e.g., pressure) sensor modules:  
Barometric altitude measurement for portable  
navigation  
Altitude measurement for emergency call  
systems and car navigation  
Features  
Flexible, programmable analog front-end design;  
up to 16-bit scalable, charge-balancing two-  
segment analog-to-digital converter (ADC)  
Inside hard disk pressure measurement  
Weather forecast  
Fan control  
Fully programmable gain amplifier for optimizing  
sensor signals: gain range 14 to 72 (linear)  
ZSSC3026 Application Example  
Internal auto-compensated temperature sensor  
Digital compensation of individual sensor offset;  
1st and 2nd order compensation of sensor gain  
Digital compensation of 1st and 2nd order tem-  
perature gain and offset drift  
Intelligent power management unit  
Layout customized for die-die bonding with  
sensor for high-density chip-on-board assembly  
Typical sensor elements can achieve accuracy of  
better than ±0.10% FSO @ -40 to 85°C  
* I2C™ is a registered trademark of NXP.  
© 2016 Integrated Device Technology, Inc.  
1
March 28, 2016  

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