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ZSSC3026-KIT PDF预览

ZSSC3026-KIT

更新时间: 2022-06-24 15:40:22
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瑞萨 - RENESAS /
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47页 905K
描述
Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner

ZSSC3026-KIT 数据手册

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ZSSC3027  
Low-Power, High-Resolution  
Datasheet  
16-Bit Sensor Signal Conditioner  
Brief Description  
Benefits  
Integrated 18-bit calibration math DSP  
The ZSSC3027 is a sensor signal conditioner (SSC)  
integrated circuit for high-accuracy amplification and  
analog-to-digital conversion of a differential input  
signal. Designed for high-resolution altimeter module  
applications, the ZSSC3027 can perform offset,  
span, and 1st and 2nd order temperature compen-  
sation of the measured signal. Developed for correc-  
tion of resistive bridge sensors, it can also provide a  
corrected temperature output measured with an  
internal sensor.  
Fully corrected signal at digital output  
One-pass calibration minimizes calibration costs  
No external trimming, filter, or buffering com-  
ponents required  
Highly integrated CMOS design  
Excellent for low-voltage and low-power battery  
applications  
Optimized for operation in calibrated resistive  
sensor modules  
The measured and corrected bridge values are  
provided at the digital output pins, which can be  
configured as I2C™* (3.4MHz) or SPI (20MHz).  
Digital compensation of signal offset, sensitivity,  
temperature, and non-linearity is accomplished via  
an 18-bit internal digital signal processor (DSP) run-  
ning a correction algorithm. Calibration coefficients  
are stored on-chip in a highly reliable, non-volatile,  
multiple-time programmable (MTP) memory. Pro-  
gramming the ZSSC3027 is simple via the serial  
interface. The IC-internal charge pump provides the  
MTP programming voltage. The interface is used for  
the PC-controlled calibration procedure, which pro-  
grams the set of calibration coefficients in memory.  
Physical Characteristics  
Supply voltage range: 1.7 to 3.6V  
Operating mode current consumption:  
930µA (typical)  
Sleep State current: 20nA (typical)  
Temperature resolution: <0.003K/LSB  
Operation temperatures: –40°C to +85°C  
Small die size  
Delivery options: die for wafer bonding  
Available Support  
The ZSSC3027 provides accelerated signal process-  
ing in order to support high-speed control, safety,  
and real-time sensing applications. It complements  
IDT’s ZSSC30x6 products.  
ZSSC3026 Evaluation Kit can be used to  
evaluate ZSSC3027 capabilities  
Support Documentation  
ZSSC3027 Application Example  
Features  
Flexible, programmable analog front-end design;  
up to 16-bit scalable, charge-balancing two-  
segment analog-to-digital converter (ADC)  
Fully programmable gain amplifier accepting  
sensors from 14 to 72 (linear factor)  
Internal auto-compensated temperature sensor  
Digital compensation of individual sensor offset;  
1st and 2nd order digital compensation of sensor  
gain as well as of 1st and 2nd order temperature  
gain and offset drift  
Layout optimized for stacked-die bonding for  
high-density chip-on-board assembly  
* I2C™ is a trademark of NXP.  
** FSO = Full Scale Output.  
Typical sensor elements can achieve accuracy of  
better than ±0.10% FSO** @ -40 to 85°C  
1
April 20, 2016  

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