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ZSSC3018BAB

更新时间: 2024-01-16 08:37:53
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
50页 1243K
描述
Analog Circuit

ZSSC3018BAB 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:UUC,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.57
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-XUCC-N
信道数量:1功能数量:1
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:UUC
封装形状:RECTANGULAR封装形式:UNCASED CHIP
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):1.68 V
标称供电电压 (Vsup):1.8 V表面贴装:NO
技术:CMOS温度等级:AUTOMOTIVE
端子形式:NO LEAD端子位置:UNSPECIFIED
Base Number Matches:1

ZSSC3018BAB 数据手册

 浏览型号ZSSC3018BAB的Datasheet PDF文件第2页浏览型号ZSSC3018BAB的Datasheet PDF文件第3页浏览型号ZSSC3018BAB的Datasheet PDF文件第4页浏览型号ZSSC3018BAB的Datasheet PDF文件第5页浏览型号ZSSC3018BAB的Datasheet PDF文件第6页浏览型号ZSSC3018BAB的Datasheet PDF文件第7页 
Versatile, High Resolution 18-Bit  
Sensor Signal Conditioner  
ZSSC3018  
Datasheet  
Benefits  
Brief Description  
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.
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Integrated 26-bit calibration math DSP  
The ZSSC3018 is a sensor signal conditioner (SSC) integrated  
circuit for high-accuracy amplification and analog-to-digital  
conversion of differential or pseudo-differential input signals.  
Designed for high-resolution sensor module applications, the  
ZSSC3018 can perform offset, span, and 1st and 2nd order  
temperature compensation of the measured signal. Developed for  
correction of resistive bridge or absolute voltage sensors, it can  
also provide a corrected temperature output measured with an  
internal sensor.  
Fully corrected signal at digital output  
Layout customized for die-die bonding with sensor for high-  
density chip-on-board assembly  
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.
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One-pass calibration minimizes calibration costs  
No external trimming, filter, or buffering components required  
Highly integrated CMOS design  
Integrated reprogrammable non-volatile memory  
Excellent for low-voltage and low-power battery applications  
The measured and corrected sensor values are provided at the  
digital output pins, which can be configured as I2C (3.4MHz) or  
SPI (10MHz). Digital compensation of signal offset, sensitivity,  
temperature, and non-linearity is accomplished via a 26-bit  
internal digital signal processor (DSP) running a correction  
algorithm. Calibration coefficients are stored on-chip in a highly  
reliable, non-volatile, multiple-time programmable (MTP) memory.  
Programming the ZSSC3018 is simple via the serial interface. The  
interface is used for the PC-controlled calibration procedure,  
which programs the set of calibration coefficients in memory. The  
ZSSC3018 provides accelerated signal processing, increased  
resolution, and improved noise immunity in order to support high-  
speed control, safety, and real-time sensing applications with the  
highest requirements for energy efficiency.  
Optimized for operation in calibrated resistive sensor  
(e.g., pressure) or calibrated absolute voltage sensor  
(e.g., thermopile) modules  
Physical Characteristics  
.
.
.
Supply voltage range: 1.68V to 3.6V  
Current consumption: ~1.0mA (typical) in operating mode  
Sleep Mode current: 50nA (typical) at 125°C; 20nA (typical)  
at 85°C  
.
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Temperature resolution: <0.003K/LSB  
Best-in-class energy-efficiency:  
with 16-bit resolution: <140pJ/step  
with 18-bit resolution: <50pJ/step  
Features  
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Operation temperature: 40°C to +125°C  
.
Flexible, programmable analog front-end design; up to 18-bit  
analog-to-digital converter (ADC)  
Delivery options: die or 24-PQFN (4 x 4 mm) package  
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Fully programmable gain amplifier with gain range from 6.6 to  
216 (linear)  
* FSO = Full Scale Output.  
.
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Internal auto-compensated temperature sensor  
Digital compensation of individual sensor offset; 1st and 2nd  
order digital compensation of sensor gain as well as of 1st  
and 2nd order temperature gain and offset drift  
ZSSC3018 Application Example  
VDD  
.
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Programmable interrupt operation  
Sensor Bridge  
High-speed sensing: e.g., 16-bit conditioned sensor signal  
measurement rate >500s-1  
GND  
EOC  
ZSSC3018  
.
Typical sensor system can achieve an accuracy of better than  
±0.10% FSO* @ -40 to 125°C  
MISO  
MOSI/SDA  
SCLK/SCL  
24-PQFN  
SS  
© 2016 Integrated Device Technology, Inc  
1
November 14, 2016  

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