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ZSSC3018BAB PDF预览

ZSSC3018BAB

更新时间: 2024-01-03 03:51:19
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
50页 1243K
描述
Analog Circuit

ZSSC3018BAB 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:UUC,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.57
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-XUCC-N
信道数量:1功能数量:1
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:UUC
封装形状:RECTANGULAR封装形式:UNCASED CHIP
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):1.68 V
标称供电电压 (Vsup):1.8 V表面贴装:NO
技术:CMOS温度等级:AUTOMOTIVE
端子形式:NO LEAD端子位置:UNSPECIFIED
Base Number Matches:1

ZSSC3018BAB 数据手册

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ZSSC3018 Datasheet  
Table of Contents  
1. IC Characteristics .........................................................................................................................................................................................6  
1.1 Absolute Maximum Ratings.................................................................................................................................................................6  
1.2 Operating Conditions...........................................................................................................................................................................6  
1.3 Electrical Parameters ..........................................................................................................................................................................7  
1.4 Power Supply Rejection Ratio (RSRR) versus Frequency..................................................................................................................9  
2. Circuit Description ......................................................................................................................................................................................10  
2.1 Brief Description ................................................................................................................................................................................10  
2.2 Signal Flow and Block Diagram.........................................................................................................................................................10  
2.3 Analog Front End...............................................................................................................................................................................12  
2.3.1  
2.3.2  
2.3.3  
2.3.4  
2.3.5  
2.3.6  
Amplifier..............................................................................................................................................................................12  
Analog-to-Digital Converter ................................................................................................................................................13  
Selection of Gain and Offset Sensor System Dimensioning............................................................................................15  
Temperature Measurement................................................................................................................................................16  
External Sensor Supply: Bridge Sensors............................................................................................................................16  
External Sensor: Absolute Voltage Source Sensors ..........................................................................................................16  
2.4 Digital Section....................................................................................................................................................................................17  
2.4.1  
2.4.2  
2.4.3  
2.4.4  
2.4.5  
Digital Signal Processor (DSP) Core..................................................................................................................................17  
MTP Memory......................................................................................................................................................................17  
Clock Generator .................................................................................................................................................................17  
Power Supervision..............................................................................................................................................................17  
Interface..............................................................................................................................................................................17  
3. Functional Description................................................................................................................................................................................18  
3.1 Power-Up...........................................................................................................................................................................................18  
3.2 Measurements...................................................................................................................................................................................18  
3.3 Interrupt (EOC Pin)............................................................................................................................................................................18  
3.4 Operational Modes ............................................................................................................................................................................20  
3.4.1  
SPI/I2C Commands ............................................................................................................................................................23  
3.5 Communication Interface...................................................................................................................................................................26  
3.5.1  
3.5.2  
3.5.3  
Common Functionality........................................................................................................................................................26  
SPI......................................................................................................................................................................................27  
I2C.......................................................................................................................................................................................29  
3.6 Memory..............................................................................................................................................................................................30  
3.6.1  
3.6.2  
Programming Memory........................................................................................................................................................30  
Memory Contents ...............................................................................................................................................................31  
3.7 Calibration Sequence ........................................................................................................................................................................39  
3.7.1  
3.7.2  
3.7.3  
3.7.4  
Calibration Step 1 Assigning Unique Identification..........................................................................................................39  
Calibration Step 2 Data Collection...................................................................................................................................39  
Calibration Step 3a) Coefficient Calculations ..................................................................................................................40  
Calibration Step 3b) Post-Calibration Offset Correction ..................................................................................................40  
© 2016 Integrated Device Technology, Inc  
3
November 14, 2016  

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