YJG105N03A
Electrical Characteristics (T =25℃ unless otherwise noted)
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Parameter
Symbol
Conditions
Min
Typ
Max
Units
Static Parameter
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
Gate Threshold Voltage
BVDSS
VGS= 0V, ID=250μA
VDS=30V,VGS=0V
VGS= ±20V, VDS=0V
VDS= VGS, ID=250μA
VGS= 10V, ID=20A
VGS= 4.5V, ID=15A
IS=20A,VGS=0V
30
V
IDSS
1
±100
2.5
3.0
4.0
1.2
-
μA
nA
V
IGSS
VGS(th)
1.0
1.5
2.45
2.9
Static Drain-Source On-Resistance
RDS(ON)
mΩ
Diode Forward Voltage
Gate resistance
VSD
RG
IS
0.85
1.5
V
Ω
A
f=1MHz
-
Maximum Body-Diode Continuous Current
Dynamic Parameters
Input Capacitance
105
Ciss
Coss
Crss
4401
581
Output Capacitance
VDS=15V,VGS=0V,f=1MHZ
pF
Reverse Transfer Capacitance
Switching Parameters
Total Gate Charge
439
Qg
Qgs
Qgd
Qrr
trr
49.5
10.4
8.9
7.5
23
Gate-Source Charge
Gate-Drain Charge
VGS=10V,VDS=20V,ID=20A
nC
Reverse Recovery Charge
Reverse Recovery Time
Turn-on Delay Time
IF=20A, di/dt=500A/us
tD(on)
13
ns
Turn-on Rise Time
tr
22
VGS=10V, VDD=15V, ID=2A,RGEN=3Ω
Turn-off Delay Time
Turn-off fall Time
tD(off)
tf
63
33
A. Pulse Test: Pulse Width≤300us,Duty cycle ≤2%.
RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder
B.
RθJC is guaranteed by design, while RθJA is determined by the board design. The maximum rating presented
mounting surface of the drain pins.
here is based on mounting on a 1 in 2 pad of 2oz copper.
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S-E619
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com
Rev.3.6,14-Nov-23