UPS5100e3
5 A High Voltage Schottky Barrier Rectifier
KEY FEATURES
DESCRIPTION
This UPS5100e3 in the Powermite3® package is a high efficiency Schottky
rectifier that is also RoHS compliant offering high current/power capabilities
previously found only in much larger packages. They are ideal for SMD
applications that operate at high frequencies. In addition to its size
advantages, the Powermite3® package includes a full metallic bottom that
eliminates the possibility of solder flux entrapment during assembly and a
unique locking tab act as an efficient heat path to the heat-sink mounting. Its
innovative design makes this device ideal for use with automatic insertion
equipment.
Very low thermal resistance package
RoHS Compliant with e3 suffix part number
Guard-ring-die construction for transient
protection
Efficient heat path with Integral locking
bottom metal tab
Low forward voltage
Full metallic bottom eliminates flux
entrapment
Compatible with automatic insertion
Low profile-maximum height of 1mm
IMPORTANT: For themost current data, consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
APPLICATIONS/BENEFITS
Rating
Symbol
Value
Unit
Switching and Regulating Power Supplies.
Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
Elimination of reverse-recovery oscillations
to reduce need for EMI filtering
Charge Pump Circuits
Reduces reverse recovery loss with low IRM
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
100
V
RMS Reverse Voltage
70
5
V
A
VR(RMS)
Io
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
on Rated Load@ Tc =90 ºC
Small foot print
100
A
IFSM
190 X 260 mils (1:1 Actual size)
See mounting pad details on pg 3
Storage Temperature
Junction Temperature
-55 to +150
-55 to +125
ºC
ºC
TSTG
TJ
MECHANICAL & PACKAGING
• CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
• FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-
STD-750 method 2026 (consult factory for
Tin-Lead plating)
THERMAL CHARACTERISTICS
Thermal Resistance
Junction-to-Case (bottom)
Junction to Ambient (1)
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print
RθJC
RθJA
2.5
65
ºC/ Watt
ºC/ Watt
• POLARITY: See figure (left)
• MARKING: S5100•
Powermite 3™
• WEIGHT: 0.072 gram (approx.)
• Package dimension on last page
• Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
Copyright © 2007
10-15-2007 Rev C
Microsemi
Page 1