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UPS530 PDF预览

UPS530

更新时间: 2024-11-29 22:17:11
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
4页 183K
描述
SCHOTTKY BARRIER RECTIFIER 0.5 AMP, 30 VOLT

UPS530 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:R-PSSO-G1
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.70
风险等级:5.92外壳连接:CATHODE
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:R-PSSO-G1
JESD-609代码:e0元件数量:1
端子数量:1最高工作温度:125 °C
最低工作温度:-55 °C最大输出电流:0.5 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified最大重复峰值反向电压:30 V
表面贴装:YES技术:SCHOTTKY
端子面层:TIN LEAD端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

UPS530 数据手册

 浏览型号UPS530的Datasheet PDF文件第2页浏览型号UPS530的Datasheet PDF文件第3页浏览型号UPS530的Datasheet PDF文件第4页 
UPS530  
SCHOTTKY BARRIER RECTIFIER  
0.5 AMP,
 
30 VOLT  
W AT E R T OW N D I V I S I O N  
DESCRIPTION  
KEY FEATURES  
In Microsemi’s new Powermite SMT Package, these high efficiency Schottky  
rectifiers offer power handling capabilities previously found only in much  
larger packages. They are ideal for SMD applications that operate at high  
frequencies.  
!"Low Profile – Maximum  
height of 1.1 mm  
!"Footprint Area of 10 mm  
!"Low VF Provides Higher  
Efficiency  
In addition to its size advantages, Powermite package features include a full  
metallic bottom that eliminates the possibility of solder flux entrapment during  
assembly, and a unique locking tab acts as an integral heat sink. Its  
innovative design makes this device ideal for use with automatic insertion  
equipment.  
!"Low Thermal Resistance with  
Direct Thermal Path of Die on  
Exposed Cathode Heat Sink  
!"Supplied in 8mm Tape and  
Reel – 3,000 units/7” Reel;  
12,000 units/13” Reel  
SURFACE MOUNT  
POWERMITE  
Surface Mount Power Package  
APPLICATIONS/BENEFITS  
!"High power Surface Mount  
Package  
!"Guard Ring Protection  
!"Low forward voltage  
!"Integral Heat Sink/Locking  
Tabs  
IMPORTANT:  
For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
!"Compatible with Automatic  
Insertion Equipment  
!"Full Metallic Bottom  
Eliminates Flux Entrapment  
MECHANICAL CHARACTERISTICS  
Case: Molded Epoxy  
Meets UL94VO at 1/8 inch  
Device Marking S53  
Lead and Mounting Surface Temperature for Soldering = 260°C Maximum  
for 10 Seconds  
Copyright 2000  
Microsemi  
Page 1  
MSC1633.PDF 2000-12-01  
Watertown Division  
580 Pleasant Street Watertown, MA 02472 617-926-0404, Fax: 617-924-1235  

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