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UPS560 PDF预览

UPS560

更新时间： 2024-11-30 20:02:27
品牌 Logo 应用领域
美高森美 - MICROSEMI 功效二极管
页数 文件大小 规格书
3页 202K
描述
Rectifier Diode, Schottky, 1 Phase, 1 Element, 5A, 60V V(RRM), Silicon, SMT-2

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中文翻译

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UPS560 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active包装说明：SMT-2
针数：2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.80
风险等级：5.79应用：EFFICIENCY
外壳连接：CATHODE配置：SINGLE
二极管元件材料：SILICON二极管类型：RECTIFIER DIODE
JESD-30 代码：R-PSSO-G2JESD-609代码：e0
最大非重复峰值正向电流：100 A元件数量：1
相数：1端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
最大输出电流：5 A封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
最大重复峰值反向电压：60 V表面贴装：YES
技术：SCHOTTKY端子面层：TIN LEAD
端子形式：GULL WING端子位置：SINGLE
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

UPS560 数据手册

 浏览型号UPS560的Datasheet PDF文件第2页浏览型号UPS560的Datasheet PDF文件第3页 
UPS560e3  
5 A Schottky Barrier Rectifier  
KEY FEATURES  
DESCRIPTION  
This UPS560e3 in the Powermite3® package is a high efficiency Schottky  
rectifier that is also RoHS compliant offering high current/power capabilities  
previously found only in much larger packages. They are ideal for SMD  
applications that operate at high frequencies. In addition to its size  
advantages, the Powermite3® package includes a full metallic bottom that  
eliminates the possibility of solder flux entrapment during assembly and a  
unique locking tab act as an efficient heat path to the heat-sink mounting.  
Its innovative design makes this device ideal for use with automatic insertion  
equipment.  
ƒ
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Very low thermal resistance package  
RoHS Compliant with e3 suffix part  
number  
Guard-ring-die construction for transient  
protection  
Efficient heat path with Integral locking  
bottom metal tab  
Low forward voltage  
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Full metallic bottom eliminates flux  
entrapment  
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Compatible with automatic insertion  
Low profile-maximum height of 1mm  
Options for screening in accordance with  
MIL-PRF-19500 for JAN, JANTX,  
JANTXV, and JANS are available by  
adding MQ, MX, MV, or MSP prefixes  
respectively to part numbers. For  
example, designate MXUPS560e3 for a  
JANTX (consult factory for Tin-Lead  
plating).  
Optional 100% avionics screening  
available by adding MA prefix for 100%  
temperature cycle, thermal impedance  
and 24 hours HTRB (consult factory for  
Tin-Lead plating)  
IMPORTANT: For themost current data, consultMICROSEMI’s website: http://www.microsemi.com  
ABSOLUTE MAXIMUM RATINGS AT 25º C  
(UNLESS OTHERWISE SPECIFIED)  
Rating  
Symbol  
Value  
Unit  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
60  
V
ƒ
RMS Reverse Voltage  
42  
5
V
A
V R (RMS)  
Io  
Average Rectified Output Current  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single half sine wave Superimposed  
on Rated Load@ Tc =90 ºC  
APPLICATIONS/BENEFITS  
100  
A
IFSM  
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Switching and Regulating Power  
Supplies.  
Storage Temperature  
Junction Temperature  
TSTG  
TJ  
-55 to +150  
-55 to +125  
ºC  
ºC  
Silicon Schottky (hot carrier) rectifier for  
minimal reverse voltage recovery  
Elimination of reverse-recovery  
oscillations to reduce need for EMI  
filtering  
THERMAL CHARACTERISTICS  
Thermal Resistance  
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Charge Pump Circuits  
Reduces reverse recovery loss with low  
IRM  
Junction-to-case (bottom)  
Junction to ambient (1)  
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print  
RθJC  
RθJA  
3.2  
65  
ºC/ Watt  
ºC/ Watt  
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Small foot print  
190 X 270 mils (1:1 Actual size)  
See mounting pad details on pg 3  
Powermite 3™  
MECHANICAL & PACKAGING  
•
•
CASE: Void-free transfer molded  
thermosetting epoxy compound meeting  
UL94V-0  
FINISH: Annealed matte-Tin plating over  
copper and readily solderable per MIL-  
STD-750 method 2026 (consult factory  
for Tin-Lead plating)  
•
•
•
•
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POLARITY: See figure (left)  
MARKING: S560•  
WEIGHT: 0.072 gram (approx.)  
Package dimension on last page  
Tape & Reel option: 16 mm tape per  
Standard EIA-481-B, 5000 on 13” reel  
Copyright © 2005  
5-19-2005 REV C  
Microsemi  
Page 1  
123

中文翻译

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