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UPA2782

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UPA2782GR Data Sheet | Data Sheet[04/2003]

UPA2782 数据手册

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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
µPA2782GR  
SWITCHING  
N-CHANNEL POWER MOS FET/SCHOTTKY BARRIER DIODE  
DESCRIPTION  
The µPA2782GR is N-Channel Power MOSFET, which built a  
PACKAGE DRAWING (Unit: mm)  
Schottky Barrier Diode inside.  
This product is designed for synchronous DC/DC converter  
application.  
8
5
1, 2, 3  
4
; Source  
; Gate  
5, 6, 7, 8 ; Drain  
FEATURES  
Built a Schottky Barrier Diode  
Low on-state resistance  
6.0 ±0.3  
4.4  
1
4
RDS(on)1 = 11 mTYP. (VGS = 10 V, ID = 5.5 A)  
RDS(on)2 = 16 mTYP. (VGS = 4.5 V, ID = 5.5 A)  
RDS(on)3 = 19 mTYP. (VGS = 4.0 V, ID = 5.5 A)  
Low Ciss: Ciss = 660 pF TYP.  
5.37 MAX.  
0.8  
0.5 ±0.2  
Small and surface mount package (Power SOP8)  
0.10  
1.27 0.78 MAX.  
+0.10  
–0.05  
0.40  
0.12 M  
ORDERING INFORMATION  
PART NUMBER  
PACKAGE  
Power SOP8  
µ PA2782GR  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C. All terminals are connected.)  
EQUIVALENT CIRCUIT  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC) [MOSFET]  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
IF(AV)  
PT  
30  
V
V
±20  
Drain  
±11  
A
Drain Current (pulse) Note1  
±44  
A
Average Forward Current Note2 [SCHOTTKY]  
Total Power Dissipation Note3 [MOSFET]  
Total Power Dissipation Note3 [SCHOTTKY]  
Channel & Junction Temperature  
Storage Temperature  
Gate  
2.5  
A
Schottky  
Diode  
2
W
W
°C  
°C  
PT  
1
Gate  
Protection  
Diode  
Source  
Tch, Tj  
Tstg  
150  
55 to + 150  
Notes 1. PW 10 µs, Duty Cycle 1%  
2. Rectangle wave, 50% Duty Cycle  
3. Mounted on ceramic substrate of 1200 mm2 x 2.2 mm  
Caution Strong electric field, when exposed to this device, can cause destruction of the gate oxide and  
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity  
as much as possible, and quickly dissipate it once, when it has occurred.  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage exceeding  
the rated voltage may be applied to this device.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. G16421EJ1V0DS00 (1st edition)  
Date Published April 2003 NS CP(K)  
Printed in Japan  
2002  

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