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TM4FJ64NPU-40 PDF预览

TM4FJ64NPU-40

更新时间: 2024-09-13 20:01:55
品牌 Logo 应用领域
德州仪器 - TI 动态存储器内存集成电路
页数 文件大小 规格书
24页 373K
描述
4MX64 EDO DRAM MODULE, 40ns, DMA144, SODIMM-144

TM4FJ64NPU-40 技术参数

生命周期:Obsolete零件包装代码:MODULE
包装说明:SODIMM-144针数:144
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.84
访问模式:FAST PAGE WITH EDO最长访问时间:40 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHI/O 类型:COMMON
JESD-30 代码:R-XDMA-N144内存密度:268435456 bit
内存集成电路类型:EDO DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:144字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX64输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM144,32封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:3.3 V
认证状态:Not Qualified刷新周期:8192
座面最大高度:25.4 mm自我刷新:YES
最大待机电流:0.0006 A子类别:DRAMs
最大压摆率:0.64 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:0.8 mm端子位置:DUAL
Base Number Matches:1

TM4FJ64NPU-40 数据手册

 浏览型号TM4FJ64NPU-40的Datasheet PDF文件第2页浏览型号TM4FJ64NPU-40的Datasheet PDF文件第3页浏览型号TM4FJ64NPU-40的Datasheet PDF文件第4页浏览型号TM4FJ64NPU-40的Datasheet PDF文件第5页浏览型号TM4FJ64NPU-40的Datasheet PDF文件第6页浏览型号TM4FJ64NPU-40的Datasheet PDF文件第7页 
SMMS693A − AUGUST 1997 − REVISED NOVEMBER 1997  
D
Organization  
− TM4xJ64xPU-xx . . . 4194304 × 64 Bits  
− TM8xJ64xPU-xx . . . 8388608 × 64 Bits  
Single 3.3-V Power Supply  
( 10% Tolerance)  
D
Long Refresh Periods:  
− TMxEJ64KPU: 64 ms (4096 Cycles)  
− TMxEJ64NPU: 64 ms (8192 Cycles)  
− TMxFJ64KPU: 128 ms (4096 Cycles)  
− TMxFJ64NPU: 128 ms (8192 Cycles)  
D
D
D
Extended Data Out (EDO) Operation With  
CAS-Before-RAS (CBR), RAS-Only, and  
Hidden Refresh  
JEDEC 144-Pin Small-Outline Dual-In-Line  
Memory Module (SODIMM) Without Buffer  
for Use With Socket  
D
D
D
Serial Presence-Detect (SPD) Using  
EEPROM  
D
D
TM4xJ64xPU-xx — Utilizes Four 64M-Bit  
High-Speed (4M×16-Bit) Dynamic RAMs  
TM4xJ64xPU-xx — Utilizes Eight 64M-Bit  
High-Speed (4M×16-Bit) Dynamic RAMs  
Ambient Temperature Range  
0°C to 70°C  
Performance Ranges  
D
High-Speed, Low-Noise LVTTL Interface  
ACCESS ACCESS ACCESS EDO  
D
High-Reliability 50-Lead 400-Mil-Wide  
Surface-Mount Thin Small-Outline Package  
(TSOP) (DGE Suffix)  
TIME  
TIME  
TIME CYCLE  
t
t
t
t
HPC  
RAC  
CAC  
AA  
(MAX)  
40 ns  
50 ns  
60 ns  
(MAX)  
11 ns  
13 ns  
15 ns  
(MAX)  
20 ns  
25 ns  
30 ns  
(MIN)  
16 ns  
20 ns  
25 ns  
D
D
3-State Output  
’xxJ64xPU-40  
’xxJ64xPU-50  
’xxJ64xPU-60  
Gold-Plated Contacts  
description  
The TM4xJ64KPU is a 32M-byte, 144-pin, small-outline dual-in-line memory module (SODIMM). The SODIMM  
is composed of four TMS465169/P, 4194304 × 16-bit 4K normal or low-power battery-backup refresh EDO  
dynamic random-access memory (DRAM) devices, each in a 400-mil, 50-pin plastic thin small-outline package  
(TSOP) (DGE suffix) package mounted on a substrate with decoupling capacitors. See the TMS465169/P data  
sheet (literature number SMHS566).  
The TM4xJ64NPU is a 32M-byte, 144-pin SODIMM. The SODIMM is composed of four TMS464169/P,  
4194304 × 16-bit 8K normal or low-power battery-backup refresh EDO DRAMs, each in a 400-mil, 50-pin plastic  
TSOP (DGE suffix) mounted on a substrate with decoupling capacitors. See the TMS464169/P data sheet  
(literature number SMHS566).  
The TM8xJ64KPU is a 64M-byte, 144-pin SODIMM. The SODIMM is composed of eight TMS465169/P,  
4194304 × 16-bit 4K normal or low-power battery-backup refresh EDO DRAMs, each in a 400-mil, 50-pin plastic  
TSOP (DGE suffix) mounted on a substrate with decoupling capacitors.  
The TM8xJ64NPU is a 64M-byte, 144-pin SODIMM. The SODIMM is composed of eight TMS464169/P,  
4194304 × 16-bit 8K normal or low-power battery-backup refresh EDO DRAMs, each in a 400-mil, 50-pin plastic  
TSOP (DGE suffix) mounted on a substrate with decoupling capacitors.  
operation  
The TM4xJ64xPU operates as four TMS46x169/Ps that are connected as shown in the TMxxJ64xPU functional  
block diagram. The TM8xJ64xPU operates as eight TMS46x169/Ps that are connected as shown in the  
TMxxJ64xPU functional block diagram.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢇꢛ ꢙ ꢗꢈ ꢚ ꢀ ꢇꢛ ꢃꢟ ꢔꢃꢠ ꢡꢢ ꢣ ꢤꢥ ꢦ ꢧꢨ ꢡꢤꢢ ꢩꢤ ꢢꢩꢪ ꢥ ꢢꢫ ꢬꢥ ꢤꢭ ꢮꢩꢨ ꢫ ꢡꢢ ꢨꢯ ꢪ ꢣꢤ ꢥꢦ ꢧꢨ ꢡꢰ ꢪ ꢤꢥ  
ꢭꢪ ꢫ ꢡ ꢱꢢ ꢬꢯ ꢧ ꢫ ꢪ ꢤꢣ ꢭꢪ ꢰ ꢪ ꢲꢤ ꢬꢦꢪ ꢢꢨꢳ ꢚ ꢯꢧ ꢥꢧ ꢩꢨ ꢪꢥ ꢡꢫ ꢨꢡ ꢩ ꢭꢧ ꢨꢧ ꢧꢢ ꢭ ꢤꢨ ꢯꢪꢥ  
ꢫ ꢬꢪ ꢩ ꢡ ꢣꢡ ꢩ ꢧ ꢨ ꢡꢤ ꢢꢫ ꢧ ꢥ ꢪ ꢭꢪ ꢫ ꢡ ꢱꢢ ꢱꢤꢧ ꢲꢫ ꢳ ꢀꢪꢴ ꢧꢫ ꢔꢢꢫ ꢨꢥ ꢮꢦ ꢪꢢꢨ ꢫ ꢥ ꢪꢫ ꢪꢥ ꢰ ꢪꢫ ꢨꢯ ꢪ ꢥ ꢡꢱꢯ ꢨ ꢨꢤ  
ꢩ ꢯꢧ ꢢ ꢱꢪ ꢤꢥ ꢭꢡ ꢫ ꢩ ꢤꢢ ꢨꢡ ꢢꢮꢪ ꢨ ꢯꢪ ꢫ ꢪ ꢬꢥ ꢤꢭ ꢮꢩꢨ ꢫ ꢵ ꢡꢨꢯ ꢤꢮꢨ ꢢꢤꢨ ꢡꢩꢪ ꢳ  
Copyright 1997, Texas Instruments Incorporated  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  

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