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TIM6472-35SL_06 PDF预览

TIM6472-35SL_06

更新时间: 2022-09-19 10:48:42
品牌 Logo 应用领域
东芝 - TOSHIBA 微波
页数 文件大小 规格书
4页 472K
描述
MICROWAVE POWER GaAs FET

TIM6472-35SL_06 数据手册

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MICROWAVE POWER GaAs FET  
MICROWAVE SEMICONDUCTOR  
TIM6472-35SL  
TECHNICAL DATA  
FEATURES  
n LOW INTERMODULATION DISTORTION  
n HIGH GAIN  
IM3=-45 dBc at Pout= 35.0dBm  
G1dB=8.0dB at 6.4GHz to 7.2GHz  
Single Carrier Level  
n HIGH POWER  
n BROADBAND INTERNALLY MATCHED  
n HERMETICALLY SEALED PACKAGE  
P1dB=45.5dBm at 6.4GHz to 7.2GHz  
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )  
°
CHARACTERISTICS  
Output Power at 1dB Gain  
Compression Point  
Power Gain at 1dB Gain  
Compression Point  
Drain Current  
SYMBOL  
CONDITIONS  
UNIT MIN. TYP. MAX.  
P1dB  
dBm 45.0 45.5  
¾
VDS= 10V  
f = 6.4 to 7.2GHz  
G1dB  
dB  
7.0  
8.0  
¾
IDS1  
DG  
hadd  
IM3  
A
dB  
%
8.0  
¾
9.0  
±0.8  
¾
¾
¾
Gain Flatness  
Power Added Efficiency  
3rd Order Intermodulation  
Distortion  
37  
-45  
¾
Two Tone Test  
Po=35.0dBm  
dBc  
-42  
¾
(Single Carrier Level)  
Drain Current  
IDS2  
A
8.0  
9.0  
¾
¾
(VDS X IDS + Pin – P1dB)  
X Rth(c-c)  
Channel Temperature Rise  
DTch  
C
°
100  
¾
Recommended Gate Resistance(Rg) : 28 W (Max.)  
ELECTRICAL CHARACTERISTICS ( Ta= 25 C )  
°
CHARACTERISTICS  
SYMBOL  
CONDITIONS  
UNIT MIN. TYP. MAX.  
Transconductance  
gm  
V
= 3V  
= 10.5A  
mS  
6500  
-2.5  
20  
DS  
¾
¾
I
DS  
Pinch-off Voltage  
VGSoff  
IDSS  
VDS= 3V  
IDS= 140mA  
VDS= 3V  
VGS= 0V  
V
-1.0  
-4.0  
26  
Saturated Drain Current  
A
¾
-5  
¾
IGS= -420 A  
Gate-Source Breakdown  
Voltage  
VGSO  
Rth(c-c)  
m
V
¾
¾
C/W  
Thermal Resistance  
Channel to Case  
°
1.0  
1.3  
u The information contained herein is presented only as a guide for the applications of our products. No responsibility is  
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,  
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.  
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA  
before proceeding with design of equipment incorporating this product.  
Rev. Jul., 2006  

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