MICROWAVE POWER GaAs FET
MICROWAVE SEMICONDUCTOR
TIM6472-35SL
TECHNICAL DATA
FEATURES
n LOW INTERMODULATION DISTORTION
n HIGH GAIN
IM3=-45 dBc at Pout= 35.0dBm
G1dB=8.0dB at 6.4GHz to 7.2GHz
Single Carrier Level
n HIGH POWER
n BROADBAND INTERNALLY MATCHED
n HERMETICALLY SEALED PACKAGE
P1dB=45.5dBm at 6.4GHz to 7.2GHz
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )
°
CHARACTERISTICS
Output Power at 1dB Gain
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
SYMBOL
CONDITIONS
UNIT MIN. TYP. MAX.
P1dB
dBm 45.0 45.5
¾
VDS= 10V
f = 6.4 to 7.2GHz
G1dB
dB
7.0
8.0
¾
IDS1
DG
hadd
IM3
A
dB
%
8.0
¾
9.0
±0.8
¾
¾
¾
Gain Flatness
Power Added Efficiency
3rd Order Intermodulation
Distortion
37
-45
¾
Two Tone Test
Po=35.0dBm
dBc
-42
¾
(Single Carrier Level)
Drain Current
IDS2
A
8.0
9.0
¾
¾
(VDS X IDS + Pin – P1dB)
X Rth(c-c)
Channel Temperature Rise
DTch
C
°
100
¾
Recommended Gate Resistance(Rg) : 28 W (Max.)
ELECTRICAL CHARACTERISTICS ( Ta= 25 C )
°
CHARACTERISTICS
SYMBOL
CONDITIONS
UNIT MIN. TYP. MAX.
Transconductance
gm
V
= 3V
= 10.5A
mS
6500
-2.5
20
DS
¾
¾
I
DS
Pinch-off Voltage
VGSoff
IDSS
VDS= 3V
IDS= 140mA
VDS= 3V
VGS= 0V
V
-1.0
-4.0
26
Saturated Drain Current
A
¾
-5
¾
IGS= -420 A
Gate-Source Breakdown
Voltage
VGSO
Rth(c-c)
m
V
¾
¾
C/W
Thermal Resistance
Channel to Case
°
1.0
1.3
u The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Rev. Jul., 2006