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TC51W3216XB-85 PDF预览

TC51W3216XB-85

更新时间: 2024-02-08 03:50:34
品牌 Logo 应用领域
东芝 - TOSHIBA 内存集成电路
页数 文件大小 规格书
11页 186K
描述
IC 2M X 16 PSEUDO STATIC RAM, 85 ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, PLASTIC, TFBGA-48, Static RAM

TC51W3216XB-85 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.92
最长访问时间:85 nsJESD-30 代码:R-PBGA-B48
长度:9 mm内存密度:33554432 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:16
功能数量:1端子数量:48
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-25 °C组织:2MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.5 V
标称供电电压 (Vsup):2.75 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mmBase Number Matches:1

TC51W3216XB-85 数据手册

 浏览型号TC51W3216XB-85的Datasheet PDF文件第5页浏览型号TC51W3216XB-85的Datasheet PDF文件第6页浏览型号TC51W3216XB-85的Datasheet PDF文件第7页浏览型号TC51W3216XB-85的Datasheet PDF文件第8页浏览型号TC51W3216XB-85的Datasheet PDF文件第10页浏览型号TC51W3216XB-85的Datasheet PDF文件第11页 
TC51W3216XB-80,-85  
Deep Power-down Timing  
CE  
t
DPD  
CS  
t
t
CH  
CS  
Power-on Timing  
V
min  
DD  
V
DD  
CE  
CS  
t
CHC  
t
CH  
t
CHP  
Prohibition Timing  
CE  
CS  
OE  
WE  
The timing shown above is prohibited.  
If both OE and WE go Low coincident with or before falling edge of CE , a malfunction may occur since  
devices go into test modes for internal use.  
Notes:  
(1)  
Stresses greater than listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device.  
(2)  
(3)  
(4)  
(5)  
(6)  
All voltages are reference to GND.  
I
I
depends on the cycle time.  
depends on output loading. Specified values are defined with the output open condition.  
DDO  
DDO  
AC measurements are assumed t , t = 5 ns.  
R
F
WHZ  
Parameters t  
, t  
, t  
and t  
define the time at which the output goes the open condition and  
CHZ OHZ BHZ  
are not output voltage reference levels.  
(7)  
(8)  
During write cycles, input data is latched on the earliest of WE , LB / UB or CE rising edge.  
Therefore, input data must be valid during the set-up time (t , t or t ) and hold time(t  
,
DSC DSB DSW DHC  
t
or t ).  
DHW  
DHB  
Address(A2 to A20) inputs are latched on the falling edge of CE . Therefore, addresses(A2 to A20) input  
must be valid during the set-up time (t ) and hold time(t ).  
ASC AHC  
(9)  
(10)  
(11)  
Data cannot be retained at deep power-down stand-by mode  
If OE is high during the write cycle, the outputs will remain at high impedance.  
During the output state of I/O signals, input signals of reverse polarity must not be applied.  
2002-03-14 9/11  

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