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TBSL40A-TP PDF预览

TBSL40A-TP

更新时间: 2024-11-19 09:30:59
品牌 Logo 应用领域
美微科 - MCC 光电二极管
页数 文件大小 规格书
3页 454K
描述
Bridge Rectifier Diode,

TBSL40A-TP 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:not_compliant风险等级:5.82
最小击穿电压:50 V配置:BRIDGE, 4 ELEMENTS
二极管元件材料:SILICON二极管类型:BRIDGE RECTIFIER DIODE
JESD-30 代码:R-PDSO-F4湿度敏感等级:1
最大非重复峰值正向电流:110 A元件数量:4
相数:1端子数量:4
最高工作温度:150 °C最低工作温度:-55 °C
最大输出电流:4 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED最大重复峰值反向电压:50 V
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

TBSL40A-TP 数据手册

 浏览型号TBSL40A-TP的Datasheet PDF文件第2页浏览型号TBSL40A-TP的Datasheet PDF文件第3页 
M C C  
TBSL40A  
THRU  
R
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20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
Micro Commercial Components  
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$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TBSL40M  
Features  
4.0 Amp Single Phase  
Glass Passivated  
Bridge Rectifier  
Glass passivated chip  
·
High surge forward current capability  
Halogen free available upon request by adding suffix "-HF"  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
50 to 1000 Volts  
Compliant. See ordering information)  
Mechanical Data  
TBSL  
A
Operating Temperature: -55°C to +150°C  
Storage Temperature: -55°C to +150°C  
D
C
MCC  
Part  
Number  
Maximum  
Recurrent  
Marking Peak Reverse  
Voltage  
Maximum  
RMS  
Voltage  
Maximum  
DC  
Blocking  
Voltage  
50V  
100V  
200V  
Device  
B
J
TBSL40A  
TBSL40B  
TBSL40D  
TBSL40G  
TBSL40J  
TBSL40K  
TBSL40M  
50V  
100V  
200V  
400V  
600V  
800V  
1000V  
35V  
70V  
140V  
280V  
420V  
TBSL40A  
TBSL40B  
TBSL40D  
TBSL40G  
TBSL40J  
TBSL40K  
TBSL40M  
E
400V  
600V  
H
560V  
700V  
800V  
1000V  
G
F
Electrical Characteristics @ 25OC Unless Otherwise Specified  
Average Forward  
Current  
IF(AV)  
Tc=90  
4.0 A  
110A  
Peak Forward Surge  
Current  
Maximum  
Instantaneous  
Forward Voltage  
Maximum DC  
Reverse Current At  
Rated DC Blocking  
Voltage  
IFSM  
8.3ms, half sine  
I
TA = 25OC  
TA = 25OC  
IFM = 2.0A;  
IFM = 4.0A;  
0.95V  
1.00V  
ꢀꢁꢂꢃꢄꢅꢁꢆꢄꢅ  
VF  
ꢇꢃꢅ  
ꢋ ꢋ ꢋ ꢋ ꢁꢄꢌ  
ꢂꢂ  
ꢀꢁꢂ  
ꢂꢁꢄ  
.327  
.399  
ꢂꢈꢉ  
.342  
.415  
.228  
.074  
.005  
.244  
.039  
ꢂꢁꢄ  
ꢂꢈꢉ  
8.70  
ꢄꢆꢊꢃ  
8.30  
OC  
IR  
5μA  
Tj = 25  
10.55  
5.80  
1.90  
B
C
D
E
F
10.15  
5.60  
1.70  
0.02  
5.80  
0.20  
OC  
.220  
.067  
.001  
.228  
.008  
Tj = 125  
100μA  
0.12  
6.20  
R
RthJL  
Typical Thermal  
Resistance  
32 °C/W  
15 °C/W  
9 °C/W  
thJA  
G
H
1.00  
2.10  
2.40  
9.40  
.075  
.087  
.083  
.094  
1.90  
2.20  
I
J
RthJC  
.354  
9.00  
.370  
I2t  
50.2A2s  
Mounting Pad Layout  
Dimensions in inches and (millimeters)  
Rating For Fusing  
1ms≤t<8.3ms  
.213(5.40  
)
Notes: 1.High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7  
.098(2.50)  
.248(6.30)  
.425(10.80)  
.071(1.80)  
.063(1.60)  
.224(5.70  
)
www.mccsemi.com  
1 of 3  
2018/05/07  
Revision:C  

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