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STG8M120F3D7 PDF预览

STG8M120F3D7

更新时间: 2024-11-20 14:57:31
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 双极性晶体管
页数 文件大小 规格书
10页 432K
描述
1200 V、8 A沟槽栅场截止M系列低损耗IGBT晶片,D7封装

STG8M120F3D7 数据手册

 浏览型号STG8M120F3D7的Datasheet PDF文件第2页浏览型号STG8M120F3D7的Datasheet PDF文件第3页浏览型号STG8M120F3D7的Datasheet PDF文件第4页浏览型号STG8M120F3D7的Datasheet PDF文件第5页浏览型号STG8M120F3D7的Datasheet PDF文件第6页浏览型号STG8M120F3D7的Datasheet PDF文件第7页 
STG8M120F3D7  
1200 V, 8 A trench gate field-stop M series  
low-loss IGBT die in D7 packing  
Datasheet - production data  
Features  
10 µs of short-circuit withstand time  
Low VCE(sat) = 1.85 V (typ.) @ IC = 8 A  
Positive VCE(sat) temperature coefficient  
Tight parameter distribution  
Maximum junction temperature: TJ = 175 °C  
Applications  
Motor control  
Industrial drives  
PFC  
UPS  
Solar  
General purpose inverter  
Description  
This device is an IGBT developed using an  
advanced proprietary trench gate field-stop  
structure. The device is part of the M series  
IGBTs, which represent an optimal balance  
between inverter system performance and  
efficiency where low-loss and short-circuit  
functionality are essential. Furthermore, the  
positive VCE(sat) temperature coefficient and tight  
parameter distribution result in safer paralleling  
operation.  
Table 1: Device summary  
Order code  
VCE  
ICN  
Die size  
Packing  
STG8M120F3D7  
1200 V  
8 A  
3.44 x 3.44 mm²  
D7  
November 2017  
DocID030930 Rev 2  
1/10  
www.st.com  
This is information on a product in full production.  

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