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STD2NC50 PDF预览

STD2NC50

更新时间: 2024-11-19 22:12:19
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 晶体晶体管开关脉冲
页数 文件大小 规格书
10页 446K
描述
N-CHANNEL 500V - 3ohm - 2.2A DPAK/IPAK PowerMesh⑩II MOSFET

STD2NC50 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-252
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliant风险等级:5.64
Is Samacsys:N雪崩能效等级(Eas):140 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):2.2 A最大漏极电流 (ID):2.2 A
最大漏源导通电阻:4 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252JESD-30 代码:R-PSSO-G2
JESD-609代码:e3元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):45 W最大脉冲漏极电流 (IDM):8.8 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

STD2NC50 数据手册

 浏览型号STD2NC50的Datasheet PDF文件第2页浏览型号STD2NC50的Datasheet PDF文件第3页浏览型号STD2NC50的Datasheet PDF文件第4页浏览型号STD2NC50的Datasheet PDF文件第5页浏览型号STD2NC50的Datasheet PDF文件第6页浏览型号STD2NC50的Datasheet PDF文件第7页 
STD2NC50  
STD2NC50-1  
N-CHANNEL 500V - 3- 2.2A DPAK/IPAK  
PowerMesh™II MOSFET  
TYPE  
V
DSS  
R
I
D
DS(on)  
STD2NC50  
STD2NC50-1  
500 V  
500 V  
< 4 Ω  
< 4 Ω  
2.2 A  
2.2 A  
TYPICAL R (on) = 3 Ω  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
NEW HIGH VOLTAGE BENCHMARK  
GATE CHARGE MINIMIZED  
3
3
1
2
1
IPAK  
DPAK  
DESCRIPTION  
The PowerMESHII is the evolution of the first  
generation of MESH OVERLAY™. The layout re-  
finements introduced greatly improve the Ron*area  
figure of merit while keeping the device at the lead-  
ing edge for what concerns swithing speed, gate  
charge and ruggedness.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
HIGH CURRENT, HIGH SPEED SWITCHING  
SWITH MODE POWER SUPPLIES (SMPS)  
DC-AC CONVERTERS FOR WELDING  
EQUIPMENT AND UNINTERRUPTIBLE  
POWER SUPPLIES AND MOTOR DRIVER  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
500  
500  
±30  
2.2  
Unit  
V
V
DS  
Drain-source Voltage (V = 0)  
GS  
V
Drain-gate Voltage (R = 20 k)  
V
DGR  
GS  
V
GS  
Gate- source Voltage  
V
I
D
Drain Current (continuos) at T = 25°C  
A
C
I
Drain Current (continuos) at T = 100°C  
1.4  
A
D
C
I
(1)  
Drain Current (pulsed)  
8.8  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
45  
W
C
Derating Factor  
0.36  
3
W/°C  
V/ns  
°C  
dv/dt  
Peak Diode Recovery voltage slope  
Storage Temperature  
T
stg  
–60 to 150  
150  
T
Max. Operating Junction Temperature  
°C  
j
(•)Pulse width limited by safe operating area  
(1)I 2.2A, di/dt 100A/µs, V V  
, T T  
(BR)DSS j JMAX  
SD  
DD  
May 2001  
1/10  

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