是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LFBGA, |
针数: | 96 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.26 |
系列: | SSTU | JESD-30 代码: | R-PBGA-B96 |
长度: | 13.5 mm | 逻辑集成电路类型: | D FLIP-FLOP |
湿度敏感等级: | 2 | 位数: | 14 |
功能数量: | 1 | 端子数量: | 96 |
最高工作温度: | 70 °C | 最低工作温度: | |
输出特性: | OPEN-DRAIN | 输出极性: | COMPLEMENTARY |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 传播延迟(tpd): | 1.8 ns |
认证状态: | Not Qualified | 座面最大高度: | 1.5 mm |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
触发器类型: | POSITIVE EDGE | 宽度: | 5.5 mm |
最小 fmax: | 450 MHz | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SSTUH32864EC/G,557 | NXP |
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SSTUH32864EC | |
SSTUH32865 | NXP |
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1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDIMM applicatio | |
SSTUH32865ET | NXP |
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1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDIMM applicatio | |
SSTUH32865ET,518 | NXP |
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SSTUH32865 - 1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDI | |
SSTUH32865ET,551 | NXP |
获取价格 |
SSTUH32865 - 1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDI | |
SSTUH32865ET/G | NXP |
获取价格 |
1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDIMM applicatio | |
SSTUH32865ET/G,551 | NXP |
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SSTUH32865 - 1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDI | |
SSTUH32866 | NXP |
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1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with p | |
SSTUH32866EC | NXP |
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1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with p | |
SSTUH32866EC/G | NXP |
获取价格 |
1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with p |