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SSTUM32868ET/G PDF预览

SSTUM32868ET/G

更新时间: 2024-02-03 06:18:44
品牌 Logo 应用领域
恩智浦 - NXP 双倍数据速率
页数 文件大小 规格书
30页 169K
描述
1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications

SSTUM32868ET/G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA, BGA176,8X22,25
针数:176Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.84
系列:32868JESD-30 代码:R-PBGA-B176
长度:15 mm逻辑集成电路类型:D FLIP-FLOP
湿度敏感等级:2位数:28
功能数量:1端子数量:176
最高工作温度:85 °C最低工作温度:
输出特性:OPEN-DRAIN输出极性:COMPLEMENTARY
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA176,8X22,25封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.8 V传播延迟(tpd):1.5 ns
认证状态:Not Qualified座面最大高度:1.15 mm
子类别:Other Logic ICs最大供电电压 (Vsup):2 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL EXTENDED端子形式:BALL
端子节距:0.65 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40触发器类型:POSITIVE EDGE
宽度:6 mm最小 fmax:450 MHz
Base Number Matches:1

SSTUM32868ET/G 数据手册

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SSTUM32868  
1.8 V 28-bit 1 : 2 configurable registered buffer with parity for  
DDR2-800 RDIMM applications  
Rev. 02 — 2 March 2007  
Product data sheet  
1. General description  
The SSTUM32868 is a 1.8 V 28-bit 1 : 2 register specifically designed for use on two rank  
by four (2R × 4) and similar high-density Double Data Rate 2 (DDR2) memory modules. It  
is similar in function to the JEDEC-standard 14-bit DDR2 register, but integrates the  
functionality of the normally required two registers in a single package, thereby freeing up  
board real-estate and facilitating routing to accommodate high-density Dual In-line  
Memory Module (DIMM) designs.  
The SSTUM32868 also integrates a parity function, which accepts a parity bit from the  
memory controller, compares it with the data received on the D-inputs and indicates  
whether a parity error has occurred on its open-drain PTYERR pin (active LOW).  
It further offers added features over the JEDEC standard register in that it is permanently  
configured for high output drive strength. This allows use in high density designs with  
heavier than normal net loading conditions. Furthermore, the SSTUM32868 features two  
additional chip select inputs, which allow more versatile enabling and disabling in densely  
populated memory modules. Both added features (drive strength and chip selects) are  
fully backward compatible to the JEDEC standard register. Finally, the SSTUM32868 is  
optimized for the fastest propagation delay in the SSTU family of registers.  
The SSTUM32868 is packaged in a 176-ball, 8 × 22 grid, 0.65 mm ball pitch, thin profile  
fine-pitch ball grid array (TFBGA) package, which (while requiring a minimum  
6 mm × 15 mm of board space) allows for adequate signal routing and escape using  
conventional card technology.  
2. Features  
I 28-bit data register supporting DDR2  
I Fully compliant to JEDEC standard for SSTUB32868  
I Supports 2 rank by 4 DIMM density by integrating equivalent functionality of two  
JEDEC-standard DDR2 registers (that is, 2 × SSTUA32864 or 2 × SSTUA32866)  
I Parity checking function across 22 input data bits  
I Parity out signal  
I Controlled multi-impedance output impedance drivers enable optimal signal integrity  
and speed  
I Meets or exceeds SSTUB32868 JEDEC standard speed performance  
I Supports up to 450 MHz clock frequency of operation  
I Permanently configured for high output drive  
I Optimized pinout for high-density DDR2 module design  
I Chip-selects minimize power consumption by gating data outputs from changing state  

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