是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 9 X 13 MM, 0.80 MM HEIGHT, LEAD FREE, PLASTIC, SOT-802-1, TFBGA-160 |
针数: | 160 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.84 |
系列: | SSTU | JESD-30 代码: | R-PBGA-B160 |
长度: | 13 mm | 逻辑集成电路类型: | D FLIP-FLOP |
湿度敏感等级: | 2 | 位数: | 28 |
功能数量: | 1 | 端子数量: | 160 |
最高工作温度: | 70 °C | 最低工作温度: | |
输出特性: | OPEN-DRAIN | 输出极性: | COMPLEMENTARY |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装等效代码: | BGA160,12X18,25 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.8 V | 传播延迟(tpd): | 1.8 ns |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Other Logic ICs | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 0.65 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 触发器类型: | POSITIVE EDGE |
宽度: | 9 mm | 最小 fmax: | 450 MHz |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SSTUH32865ET/G,551 | NXP |
获取价格 |
SSTUH32865 - 1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDI |
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SSTUH32866 | NXP |
获取价格 |
1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with p |
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SSTUH32866EC | NXP |
获取价格 |
1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with p |
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SSTUH32866EC/G | NXP |
获取价格 |
1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with p |
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SST-ULD-S1 | DOMINANT |
获取价格 |
SpiceLED InGaN S-Spice |
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SST-ULD-S2 | DOMINANT |
获取价格 |
SpiceLED InGaN S-Spice |
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SST-ULD-ST1-1 | DOMINANT |
获取价格 |
SpiceLED InGaN S-Spice |
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SST-ULD-T1 | DOMINANT |
获取价格 |
SpiceLED InGaN S-Spice |
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SSTUM32865 | NXP |
获取价格 |
1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-800 RDIMM applications |
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SSTUM32865EG | NXP |
获取价格 |
1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-800 RDIMM applications |
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