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SQ7415AEN-T1-GE3 PDF预览

SQ7415AEN-T1-GE3

更新时间: 2024-01-20 19:27:30
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
14页 577K
描述
Automotive P-Channel 60 V (D-S) 175 °C MOSFET

SQ7415AEN-T1-GE3 数据手册

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SQ7415AEN  
Vishay Siliconix  
www.vishay.com  
Automotive P-Channel 60 V (D-S) 175 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• TrenchFET® Power MOSFET  
- 60  
0.065  
0.090  
- 16  
• PowerPAK® Package  
- Low Thermal Resistance, RthJC  
- Low 1.07 mm Profile  
R
DS(on) () at VGS = - 10 V  
DS(on) () at VGS = - 4.5 V  
R
ID (A)  
• AEC-Q101 Qualifiedd  
Configuration  
Single  
• 100 % Rg and UIS Tested  
PowerPAK 1212-8  
• Material categorization: For definitions of  
compliance please see www.vishay.com/doc?99912  
S
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
G
4
D
8
D
7
D
6
D
5
D
P-Channel MOSFET  
Bottom View  
Marking Code: Q014  
ORDERING INFORMATION  
Package  
PowerPAK 1212-8  
Lead (Pb)-free and Halogen-free  
SQ7415AEN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
- 60  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
T
C = 25 °Ca  
C = 125 °C  
- 16  
Continuous Drain Current  
ID  
T
- 11  
Continuous Source Current (Diode Conduction)a  
Pulsed Drain Currentb  
IS  
- 16  
A
IDM  
IAS  
EAS  
- 64  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
- 23  
L = 0.1 mH  
26  
mJ  
TC = 25 °C  
53  
Maximum Power Dissipationb  
PD  
W
TC = 125 °C  
17  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)e, f  
TJ, Tstg  
- 55 to + 175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
81  
UNIT  
Junction-to-Ambient  
PCB Mountc  
°C/W  
Junction-to-Case (Drain)  
RthJC  
2.8  
Notes  
a. Package limited.  
b. Pulse test; pulse width 300 μs, duty cycle 2 %.  
c. When mounted on 1" square PCB (FR-4 material).  
d. Parametric verification ongoing.  
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S13-1891, Rev. C, 26-Aug-13  
Document Number: 67042  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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