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SN74LVC1G66YZPR PDF预览

SN74LVC1G66YZPR

更新时间: 2024-11-20 22:06:39
品牌 Logo 应用领域
德州仪器 - TI 开关
页数 文件大小 规格书
17页 386K
描述
SINGLE BILATERAL ANALOG SWITCH

SN74LVC1G66YZPR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:DSBGA-5针数:5
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.09Is Samacsys:N
模拟集成电路 - 其他类型:SPDT标称带宽:300 MHz
JESD-30 代码:R-XBGA-B5JESD-609代码:e1
长度:1.388 mm湿度敏感等级:1
正常位置:NC信道数量:1
功能数量:1端子数量:5
标称断态隔离度:58 dB通态电阻匹配规范:12 Ω
最大通态电阻 (Ron):30 Ω最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:VFBGA封装等效代码:BGA5,3X2,20
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:0.5 mm最大信号电流:0.1 A
最大供电电流 (Isup):0.01 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):1.8 V
表面贴装:YES最长断开时间:10 ns
最长接通时间:12 ns切换:BREAK-BEFORE-MAKE
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:0.88 mmBase Number Matches:1

SN74LVC1G66YZPR 数据手册

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ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢉ  
ꢀꢊ ꢁꢈ ꢄ ꢋ ꢌꢊ ꢄꢍꢎ ꢋꢏꢍꢄ ꢍꢁꢍ ꢄꢐ ꢈ ꢀ ꢑꢊ ꢎꢆ ꢒ  
SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
D
1.65-V to 5.5-V V  
Operation  
CC  
1
2
3
5
4
A
B
GND  
V
CC  
Inputs Accept Voltages to 5.5 V  
C
Max t of 0.8 ns at 3.3 V  
pd  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
High Speed, Typically 0.5 ns  
(V  
= 3 V, C = 50 pF)  
CC  
L
3 4  
2
GND  
B
C
V
Low On-State Resistance, Typically 5.5 Ω  
(V = 4.5 V)  
1 5  
A
CC  
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This single analog switch is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of  
up to 5.5 V (peak) to be transmitted in either direction.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC1G66YEAR  
SN74LVC1G66YZAR  
SN74LVC1G66YEPR  
SN74LVC1G66YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
−40°C to 85°C  
Reel of 3000  
_ _ _C6_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G66DBVR  
SN74LVC1G66DBVT  
SN74LVC1G66DCKR  
SOT (SOT-23) − DBV  
SOT (SC-70) − DCK  
C66_  
C6_  
−40°C to 85°C  
Reel of 250  
SN74LVC1G66DCKT  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢎꢡ  
Copyright 2003, Texas Instruments Incorporated  
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢫ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

SN74LVC1G66YZPR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC1G66DBVTG4 TI

完全替代

SINGLE BILATERAL ANALOG SWITCH
SN74LVC1G66DBVR TI

完全替代

SINGLE BILATERAL ANALOG SWITCH
SN74LVC1G66YZAR TI

完全替代

SINGLE BILATERAL ANALOG SWITCH

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