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SN74LVC1G74DQER PDF预览

SN74LVC1G74DQER

更新时间： 2024-02-22 21:40:10
品牌 Logo 应用领域
德州仪器 - TI 触发器锁存器逻辑集成电路光电二极管PC
页数 文件大小 规格书
21页 811K
描述
Available in the Texas Instruments NanoFree™ Package

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SN74LVC1G74DQER 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：BGA-8
针数：8Reach Compliance Code：compliant
HTS代码：8542.39.00.01风险等级：5.65
Is Samacsys：N系列：LVC/LCX/Z
JESD-30 代码：R-PBGA-B8逻辑集成电路类型：D FLIP-FLOP
最大频率@ Nom-Sup：175000000 Hz最大I（ol）：0.024 A
位数：1功能数量：1
端子数量：8最高工作温度：85 °C
最低工作温度：-40 °C输出极性：COMPLEMENTARY
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装等效代码：BGA8,2X4,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：NOT SPECIFIED电源：3.3 V
Prop。Delay @ Nom-Sup：5.9 ns传播延迟（tpd）：14.4 ns
认证状态：Not Qualified座面最大高度：0.625 mm
子类别：FF/Latch最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：3.3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED触发器类型：POSITIVE EDGE
最小 fmax：200 MHzBase Number Matches：1

SN74LVC1G74DQER 数据手册

 浏览型号SN74LVC1G74DQER的Datasheet PDF文件第2页浏览型号SN74LVC1G74DQER的Datasheet PDF文件第3页浏览型号SN74LVC1G74DQER的Datasheet PDF文件第4页浏览型号SN74LVC1G74DQER的Datasheet PDF文件第5页浏览型号SN74LVC1G74DQER的Datasheet PDF文件第6页浏览型号SN74LVC1G74DQER的Datasheet PDF文件第7页 
SN74LVC1G74  
www.ti.com  
SCES794C –SEPTEMBER 2009–REVISED NOVEMBER 2012  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
Check for Samples: SN74LVC1G74  
1
FEATURES  
2
•
Available in the Texas Instruments NanoFree™  
Package  
•
•
•
Ioff Supports Live Insertion, Partial Power  
Down Mode, and Back Drive Protection  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.9 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-μA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
•
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
DCT PACKAGE  
(TOP VIEW)  
DCUPACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(TOP VIEW)  
A1  
B1  
C1  
D1  
A2  
B2  
C2  
D2  
1 8  
2 7  
3 6  
4 5  
VCC  
VCC  
PRE  
CLR  
Q
1
2
3
4
8
7
6
5
CLK  
D
Q
CLK  
D
Q
1
2
3
4
VCC  
8
7
6
5
CLK  
D
PRE  
CLR  
Q
PRE  
CLR  
Q
GND  
GND  
Q
RSE PACKAGE  
(TOP VIEW)  
VCC  
GND  
DQE PACKAGE  
(TOP VIEW)  
8
1
VCC  
CLK  
D
8
1
2
3
7
6
5
2
7
6
5
CLK  
D
Q
PRE  
CLR  
Q
PRE  
CLR  
Q
See mechanical drawings for dimensions  
.
3
4
Q
4
GND  
GND  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the  
other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time  
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs  
at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,  
data at the D input can be changed without affecting the levels at the outputs.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2012, Texas Instruments Incorporated  
 
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