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SN74LVC1G66DBVR PDF预览

SN74LVC1G66DBVR

更新时间: 2024-11-03 22:32:27
品牌 Logo 应用领域
德州仪器 - TI 开关
页数 文件大小 规格书
17页 386K
描述
SINGLE BILATERAL ANALOG SWITCH

SN74LVC1G66DBVR 数据手册

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ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢉ  
ꢀꢊ ꢁꢈ ꢄ ꢋ ꢌꢊ ꢄꢍꢎ ꢋꢏꢍꢄ ꢍꢁꢍ ꢄꢐ ꢈ ꢀ ꢑꢊ ꢎꢆ ꢒ  
SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
D
1.65-V to 5.5-V V  
Operation  
CC  
1
2
3
5
4
A
B
GND  
V
CC  
Inputs Accept Voltages to 5.5 V  
C
Max t of 0.8 ns at 3.3 V  
pd  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
High Speed, Typically 0.5 ns  
(V  
= 3 V, C = 50 pF)  
CC  
L
3 4  
2
GND  
B
C
V
Low On-State Resistance, Typically 5.5 Ω  
(V = 4.5 V)  
1 5  
A
CC  
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This single analog switch is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of  
up to 5.5 V (peak) to be transmitted in either direction.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC1G66YEAR  
SN74LVC1G66YZAR  
SN74LVC1G66YEPR  
SN74LVC1G66YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
−40°C to 85°C  
Reel of 3000  
_ _ _C6_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G66DBVR  
SN74LVC1G66DBVT  
SN74LVC1G66DCKR  
SOT (SOT-23) − DBV  
SOT (SC-70) − DCK  
C66_  
C6_  
−40°C to 85°C  
Reel of 250  
SN74LVC1G66DCKT  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢎꢡ  
Copyright 2003, Texas Instruments Incorporated  
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢫ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

SN74LVC1G66DBVR 替代型号

型号 品牌 替代类型 描述 数据表
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SINGLE BILATERAL ANALOG SWITCH

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