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ꢀꢊ ꢁꢈ ꢄ ꢋ ꢌꢊ ꢄꢍꢎ ꢋꢏꢍꢄ ꢍꢁꢍ ꢄꢐ ꢈ ꢀ ꢑꢊ ꢎꢆ ꢒ
SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
D
Available in the Texas Instruments
NanoStar and NanoFree Packages
D
D
D
D
D
D
D
D
D
1.65-V to 5.5-V V
Operation
CC
1
2
3
5
4
A
B
GND
V
CC
Inputs Accept Voltages to 5.5 V
C
Max t of 0.8 ns at 3.3 V
pd
High On-Off Output Voltage Ratio
High Degree of Linearity
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
High Speed, Typically 0.5 ns
(V
= 3 V, C = 50 pF)
CC
L
3 4
2
GND
B
C
V
Low On-State Resistance, Typically ≈5.5 Ω
(V = 4.5 V)
1 5
A
CC
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single analog switch is designed for 1.65-V to 5.5-V V
operation.
CC
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC1G66YEAR
SN74LVC1G66YZAR
SN74LVC1G66YEPR
SN74LVC1G66YZPR
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
−40°C to 85°C
Reel of 3000
_ _ _C6_
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
Reel of 250
Reel of 3000
SN74LVC1G66DBVR
SN74LVC1G66DBVT
SN74LVC1G66DCKR
SOT (SOT-23) − DBV
SOT (SC-70) − DCK
C66_
C6_
−40°C to 85°C
Reel of 250
SN74LVC1G66DCKT
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
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Copyright 2003, Texas Instruments Incorporated
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1
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