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SN74LVC1G66DBVTE4 PDF预览

SN74LVC1G66DBVTE4

更新时间: 2024-11-21 09:12:59
品牌 Logo 应用领域
德州仪器 - TI 复用器开关复用器或开关信号电路光电二极管
页数 文件大小 规格书
20页 687K
描述
SINGLE BILATERAL ANALOG SWITCH

SN74LVC1G66DBVTE4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOT-23
包装说明:GREEN, PLASTIC, SOT-23, 5 PIN针数:5
Reach Compliance Code:unknownHTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:5.03
Is Samacsys:N模拟集成电路 - 其他类型:SPST
JESD-30 代码:R-PDSO-G5JESD-609代码:e4
长度:2.9 mm湿度敏感等级:1
正常位置:NO信道数量:1
功能数量:1端子数量:5
标称断态隔离度:42 dB最大通态电阻 (Ron):20 Ω
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:LSSOP
封装等效代码:TSOP5/6,.11,37封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.45 mm子类别:Multiplexers or Switches
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):2.3 V表面贴装:YES
最长断开时间:6.9 ns最长接通时间:6.5 ns
切换:BREAK-BEFORE-MAKE技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.95 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.6 mmBase Number Matches:1

SN74LVC1G66DBVTE4 数据手册

 浏览型号SN74LVC1G66DBVTE4的Datasheet PDF文件第2页浏览型号SN74LVC1G66DBVTE4的Datasheet PDF文件第3页浏览型号SN74LVC1G66DBVTE4的Datasheet PDF文件第4页浏览型号SN74LVC1G66DBVTE4的Datasheet PDF文件第5页浏览型号SN74LVC1G66DBVTE4的Datasheet PDF文件第6页浏览型号SN74LVC1G66DBVTE4的Datasheet PDF文件第7页 
SN74LVC1G66  
SINGLE BILATERAL ANALOG SWITCH  
www.ti.com  
SCES323LJUNE 2001REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Low On-State Resistance, Typically 5.5 Ω  
(VCC = 4.5 V)  
1.65-V to 5.5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 0.8 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
1000-V Charged-Device Model (C101)  
High Speed, Typically 0.5 ns  
(VCC = 3 V, CL = 50 pF)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
4
C
GND  
B
1
2
3
5
A
B
V
CC  
A
B
V
CC  
1
2
3
5
1
2
3
5
4
A
B
V
CC  
2
1
5
V
A
CC  
4
GND  
C
4
GND  
C
C
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single analog switch is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of  
up to 5.5 V (peak) to be transmitted in either direction.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
_ _ _C6_  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
Reel of 3000  
SN74LVC1G66YZPR  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
Reel of 4000  
SN74LVC1G66DBVR  
SN74LVC1G66DBVT  
SN74LVC1G66DCKR  
SN74LVC1G66DCKT  
SN74LVC1G66DRLR  
SOT (SOT-23) – DBV  
C66_  
C6_  
–40°C to 85°C  
SOT (SC-70) – DCK  
SOT (SOT-553) – DRL  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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