SN74AUP1G58
LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE
www.ti.com
SCES504H–NOVEMBER 2003–REVISED DECEMBER 2007
1
FEATURES
2
•
Available in the Texas Instruments NanoFree™
Packages
•
3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
•
•
Low Static-Power Consumption
(ICC = 0.9 µA Max)
•
•
•
tpd = 5.5 ns Max at 3.3 V
Suitable for Point-to-Point Applications
Low Dynamic-Power Consumption
(Cpd = 4.6 pF Typ at 3.3 V)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
•
Low Input Capacitance (Ci = 1.5 pF Typ)
•
ESD Performance Tested Per JESD 22
Low Noise – Overshoot and Undershoot <10%
of VCC
–
2000-V Human-Body Model
(A114-B, Class II)
•
Ioff Supports Partial-Power-Down Mode
Operation
–
–
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
•
•
•
Includes Schmitt-Trigger Inputs
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
•
ESD Protection Exceeds ±5000 V With
Human-Body Model
ln1
GND
ln0
ln2
ln1
ln2
ln1
GND
ln0
ln2
VCC
VCC
GND
ln0
Y
VCC
Y
Y
DRY PACKAGE
(TOP VIEW)
YZP OR YZT PACKAGE
(BOTTOM VIEW)
YFP PACKAGE
(BOTTOM VIEW)
ln0
GND
ln1
Y
VCC
ln0
GND
ln1
Y
1
2
3
6
5
4
ln1
GND
ln0
ln2
VCC
VCC
ln2
ln2
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity,
which produces very low undershoot and overshoot characteristics.
The SN74AUP1G58 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All
inputs can be connected to VCC or GND.
The device functions as an independent gate with Schmitt-trigger inputs, which allow for slow input transition and
better switching noise immunity at the input.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NanoFree is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated