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SN74AUP1G58YFPR

更新时间： 2024-11-29 03:12:03
品牌 Logo 应用领域
德州仪器 - TI 触发器逻辑集成电路栅PC
页数 文件大小 规格书
19页 623K
描述
LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE

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SN74AUP1G58YFPR 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：BGA
包装说明：DSBGA-6针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.6Samacsys Confidence：
Samacsys Status：ReleasedSamacsys PartID：606881
Samacsys Pin Count：6Samacsys Part Category：Integrated Circuit
Samacsys Package Category：OtherSamacsys Footprint Name：BGA6C40P2X3_117X77X50
Samacsys Released Date：2017-01-12 12:59:53Is Samacsys：N
系列：AUP/ULP/VJESD-30 代码：R-XBGA-B6
JESD-609代码：e1长度：1.17 mm
负载电容（CL）：30 pF逻辑集成电路类型：LOGIC CIRCUIT
最大I（ol）：0.004 A湿度敏感等级：1
功能数量：1端子数量：6
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：3-STATE输出极性：TRUE
封装主体材料：UNSPECIFIED封装代码：VFBGA
封装等效代码：BGA6,2X3,16封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TR
峰值回流温度（摄氏度）：260电源：1.2/3.3 V
Prop。Delay @ Nom-Sup：26.6 ns认证状态：Not Qualified
施密特触发器：YES座面最大高度：0.5 mm
子类别：Gates最大供电电压 (Vsup)：3.6 V
最小供电电压 (Vsup)：0.8 V标称供电电压 (Vsup)：1.2 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.4 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：0.77 mmBase Number Matches：1

SN74AUP1G58YFPR 数据手册

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SN74AUP1G58  
LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE  
www.ti.com  
SCES504H–NOVEMBER 2003–REVISED DECEMBER 2007  
1
FEATURES  
2
•
Available in the Texas Instruments NanoFree™  
Packages  
•
3.6-V I/O Tolerant to Support Mixed-Mode  
Signal Operation  
•
•
Low Static-Power Consumption  
(ICC = 0.9 µA Max)  
•
•
•
tpd = 5.5 ns Max at 3.3 V  
Suitable for Point-to-Point Applications  
Low Dynamic-Power Consumption  
(Cpd = 4.6 pF Typ at 3.3 V)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
Low Input Capacitance (Ci = 1.5 pF Typ)  
•
ESD Performance Tested Per JESD 22  
Low Noise – Overshoot and Undershoot <10%  
of VCC  
–
2000-V Human-Body Model  
(A114-B, Class II)  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
–
–
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
•
•
•
Includes Schmitt-Trigger Inputs  
Wide Operating VCC Range of 0.8 V to 3.6 V  
Optimized for 3.3-V Operation  
•
ESD Protection Exceeds ±5000 V With  
Human-Body Model  
ln1  
GND  
ln0  
ln2  
ln1  
ln2  
ln1  
GND  
ln0  
ln2  
VCC  
VCC  
GND  
ln0  
Y
VCC  
Y
Y
DRY PACKAGE  
(TOP VIEW)  
YZP OR YZT PACKAGE  
(BOTTOM VIEW)  
YFP PACKAGE  
(BOTTOM VIEW)  
ln0  
GND  
ln1  
Y
VCC  
ln0  
GND  
ln1  
Y
1
2
3
6
5
4
ln1  
GND  
ln0  
ln2  
VCC  
VCC  
ln2  
ln2  
Y
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable  
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range  
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity,  
which produces very low undershoot and overshoot characteristics.  
The SN74AUP1G58 features configurable multiple functions. The output state is determined by eight patterns of  
3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All  
inputs can be connected to VCC or GND.  
The device functions as an independent gate with Schmitt-trigger inputs, which allow for slow input transition and  
better switching noise immunity at the input.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2003–2007, Texas Instruments Incorporated  
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