Major League Electronics .079 cl Surface Mount Box Contact - Vertical
Ordering Information
LF
SMBC-2 XX
02 XX
XXX
S
XX
X
S
V
Pins Per Row
Lead Free
01 - 40
Packing Information
Row Specification
S = Single Row
TR-P = Tape and Reel with Plastic Pick and Place pad
TB-P = Tube with Plastic Pick and Place pad
TB-0 = Tube without Pick and Place Pad
Surface Mount
If left blank, packaging at MLE's discretion
Pad may be metal, mylar or plastic
Plating Options
10µ Gold on Contact Area / Flash on Tail
Mates with:
BSTC,
G
T
Matte Tin All Over
BSTCM,
BSTCR,
BSTCRSM,
BSTS,
TBSTC,
TBSTCM,
TBSTS,
10µ Gold on Contact Area / Matte Tin on Tail
30µ Gold on Contact Area / Matte Tin on Tail
Gold Flash over Entire Pin
GT
H
Footprint
S = pin 1 right
F
Vertical
Polarized Position
Leave blank if not needed
If required, specify empty pin position, e.g. 012 for Pin 12
Specifications
Insertion Force - Single Contact only - H Plating:
3.7oz. (1,03N) avg with .0197 (0,50mm) sq. pin
Withdrawal Force - Single Contact only - H Plating:
2.2oz. (0,61N) avg with .0197 (0,50mm) sq. pin
Current Rating: 2.0 Ampere
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding: 500V AC
Contact Resistance: 20 mΩ Max.
Operating Temperature: -40°C to + 105°C
Max. Process Temperature:
TBSTCM,
TBSTS,
TSHC,
TSHCR,
TSHCRE,
TSHCRSM,
TSHR,
TSHRE,
TSHS,
Peak: 260°C up to 10 secs.
Process: 230°C up to 60 secs.
Wave: 260°C up to 6 secs.
Reflow: 260°C up to 10 secs.
TSHSCM,
TTSHC,
TTSHCR,
TTSHCRE,
TTSHR,
Manual Solder: 350°C up to 5 secs.
TTSHRE,
TTSHS,
TTSHSM
Materials
Contact Material: Phosphor Bronze
Insulator Material: Nylon 6T
Plating: Au or Sn over 50µ" (1,27) Ni
Products cut to specific sizes are uncancellable/nonreturnable
Parts are subject to change without notice
Surface Mount Box Contact
4235 Earnings Way, New Albany, Indiana, 47150, USA
1-800-782-3486 (USA/Canada/Mexico)
Tel: 812-944-7244
Fax: 812-944-7268
E-mail: mle@mlelectronics.com
Web: www.mlelectronics.com